WB60FV60ALZ

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WeEn Semiconductors Co., Ltd

WB60FV60AL/NAU000/NO MARK*CHIPS

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WeEn Semiconductors Co., Ltd

WB60FV60AL/NAU000/NO MARK*CHIPS

Technical Specifications

Parameters and characteristics for this part

Specification	WB60FV60ALZ

Current - Average Rectified (Io)	60 A
Current - Reverse Leakage @ Vr	10 µA
Mounting Type	Surface Mount
Operating Temperature - Junction [Max]	175 ░C
Operating Temperature - Junction [Min]	-40 °C
Package / Case	Die
Reverse Recovery Time (trr)	55 ns
Speed	200 mA, 500 ns
Supplier Device Package	Wafer
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	600 V
Voltage - Forward (Vf) (Max) @ If	2 V

Part	Voltage - Forward (Vf) (Max) @ If	Current - Reverse Leakage @ Vr	Voltage - DC Reverse (Vr) (Max) [Max]	Package / Case	Speed	Reverse Recovery Time (trr)	Supplier Device Package	Mounting Type	Current - Average Rectified (Io)	Technology	Operating Temperature - Junction [Min]	Operating Temperature - Junction [Max]
WeEn Semiconductors Co., Ltd WB60FV60ALZ	2 V	10 µA	600 V	Die	200 mA 500 ns	55 ns	Wafer	Surface Mount	60 A	Standard	-40 °C	175 ░C

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	432	$ 1.11

General part information

Diode 600 V 60A Surface Mount Wafer

Technical documentation and resources

No documents available