2SD2700TL

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Rohm Semiconductor

NPN, SOT-323T, 12V 2A, LOW VCE(SAT) TRANSISTOR

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DocumentsTechnical Data Sheet EN How to Use LTspice® Models: Tips for Improving Convergence +29

2SD2700TL

Active

Rohm Semiconductor

NPN, SOT-323T, 12V 2A, LOW VCE(SAT) TRANSISTOR

Deep-Dive with AI

DocumentsTechnical Data Sheet EN How to Use LTspice® Models: Tips for Improving Convergence +29

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	2SD2700TL

Current - Collector (Ic) (Max) [Max]	2 A
Current - Collector Cutoff (Max) [Max]	100 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	270
Frequency - Transition	360 MHz
Mounting Type	Surface Mount
Operating Temperature	150 °C
Power - Max [Max]	800 mW
Supplier Device Package	TUMT3
Transistor Type	NPN
Vce Saturation (Max) @ Ib, Ic	180 mV
Voltage - Collector Emitter Breakdown (Max) [Max]	12 V

2SD2700 Series

NPN, SOT-323T, 12V 2A, Low VCE(sat) Transistor

Part	DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	Vce Saturation (Max) @ Ib, Ic	Power - Max [Max]	Voltage - Collector Emitter Breakdown (Max) [Max]	Operating Temperature	Supplier Device Package	Current - Collector Cutoff (Max) [Max]	Mounting Type	Current - Collector (Ic) (Max) [Max]	Frequency - Transition	Transistor Type
Rohm Semiconductor 2SD2700TL	270	180 mV	800 mW	12 V	150 °C	TUMT3	100 nA	Surface Mount	2 A	360 MHz	NPN

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 0.85
		10	$ 0.53
		100	$ 0.34
		500	$ 0.26
		1000	$ 0.24
	Digi-Reel®	1	$ 0.85
		10	$ 0.53
		100	$ 0.34
		500	$ 0.26
		1000	$ 0.24
	Tape & Reel (TR)	3000	$ 0.16
Newark	Each (Supplied on Cut Tape)	1	$ 0.67
		10	$ 0.45
		25	$ 0.42
		50	$ 0.40
		100	$ 0.37
		250	$ 0.33
		500	$ 0.29
		1000	$ 0.25

Description

General part information

2SD2700 Series

Various products are available in lineup developed focusing on energy-saving and high reliability as main concepts, covering from ultra-compact packages to power-packages to meet the needs in market.