HSE-B20500-040H

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CUI Devices

HEATSINK: EXTRUDED; H; TO220; BLACK; L: 50MM; W: 34.5MM; H: 12.5MM

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CUI Devices

HEATSINK: EXTRUDED; H; TO220; BLACK; L: 50MM; W: 34.5MM; H: 12.5MM

Technical Specifications

Parameters and characteristics for this part

Specification	HSE-B20500-040H

Attachment Method	PC Pin, Bolt On
Fin Height	12.5 mm
Fin Height	0.492 in
Length [x]	1.969 in
Length [x]	50 mm
Material	Aluminum Alloy
Material Finish	Black Anodized
Package Cooled	TO-220
Power Dissipation @ Temperature Rise	75 °C, 8.9 W
Shape	Rectangular, Angled Fins
Thermal Resistance @ Forced Air Flow	4.85 °C/W, 200 LFM
Thermal Resistance @ Natural	8.43 °C/W
Type	Board Level, Vertical
Width	35 mm
Width [x]	1.378 in

Part	Shape	Length [x]	Length [x]	Attachment Method	Material	Package Cooled	Thermal Resistance @ Natural	Width [x]	Width	Power Dissipation @ Temperature Rise	Material Finish	Fin Height	Fin Height	Thermal Resistance @ Forced Air Flow	Type
CUI Devices HSE-B20500-040H	Rectangular Angled Fins	1.969 in	50 mm	Bolt On PC Pin	Aluminum Alloy	TO-220	8.43 °C/W	1.378 in	35 mm	8.9 W 75 °C	Black Anodized	12.5 mm	0.492 in	4.85 °C/W 200 LFM	Board Level Vertical
CUI Devices HSE-B20500-040H-01	Rectangular Angled Fins	1.969 in	50 mm	PC Pin	Aluminum Alloy	TO-220	8.43 °C/W	1.359 in	34.5 mm	8.9 W 75 °C	Black Anodized	12.5 mm	0.492 in	8.9 °C/W 200 LFM	Board Level Vertical

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink TO-220 Aluminum Alloy 8.9W @ 75°C Board Level, Vertical

Technical documentation and resources