14-81000-310C

Active

Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

14-81000-310C

Active

Aries Electronics

CONN IC DIP SOCKET 14POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	14-81000-310C

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame, Elevated
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	14
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.56 mm
Termination Post Length	0.14 in
Type	0.3 "
Type	7.62 mm
Type	DIP

14-810 Series

Part	Material Flammability Rating	Number of Positions or Pins (Grid)	Contact Finish - Post	Mounting Type	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Termination	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Type	Contact Material - Mating	Housing Material	Contact Finish - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Contact Material - Post [custom]
Aries Electronics 14-810-90R	UL94 V-0	14	Tin	Right Angle Through Hole Vertical	1 A	0.1 in	2.54 mm	Solder	Phosphor Bronze	1.27 µm	50 µin	Closed Frame	0.15 in	3.81 mm	2.54 mm	0.1 in	1.27 µm	50 µin	0.3 "	7.62 mm	DIP	Phosphor Bronze	Polyamide (PA46) Nylon 4/6
Aries Electronics 14-810-90RWR	UL94 V-0	14	Tin	Right Angle Through Hole Vertical	1 A	0.1 in	2.54 mm	Solder	Phosphor Bronze	1.27 µm	50 µin	Closed Frame	0.15 in	3.81 mm	2.54 mm	0.1 in	1.27 µm	50 µin	0.3 "	7.62 mm	DIP	Phosphor Bronze	Polyamide (PA46) Nylon 4/6
Aries Electronics 14-81000-310C	UL94 V-0	14	Gold	Through Hole	3 A	0.1 in	2.54 mm	Solder		0.25 çm	10 çin	Closed Frame Elevated	0.14 in	3.56 mm	2.54 mm	0.1 in	0.76 Ám	30 Áin	0.3 "	7.62 mm	DIP	Beryllium Copper	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	105 ░C	-55 °C	Brass
Aries Electronics 14-81040-310C	UL94 V-0	14	Gold	Through Hole	3 A	0.1 in	2.54 mm	Solder		0.25 çm	10 çin	Closed Frame Elevated	0.14 in	3.56 mm	2.54 mm	0.1 in	0.76 Ám	30 Áin	0.3 "	7.62 mm	DIP	Beryllium Copper	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	105 ░C	-55 °C	Brass
Aries Electronics 14-810-90WR	UL94 V-0	14	Gold	Right Angle Through Hole Vertical	1.5 A	0.1 in	2.54 mm	Solder	Phosphor Bronze	0.25 çm	10 çin	Closed Frame	0.145 "	3.68 mm	2.54 mm	0.1 in	0.25 çm	10 çin	0.3 "	7.62 mm	DIP	Phosphor Bronze	Polyamide (PA46) Nylon 4/6	Gold
Aries Electronics 14-810-90T	UL94 V-0	14	Tin	Right Angle Through Hole Vertical	1.5 A	0.1 in	2.54 mm	Solder	Phosphor Bronze	5.08 µm	200 µin	Closed Frame	0.145 "	3.68 mm	2.54 mm	0.1 in	5.08 µm	200 µin	0.3 "	7.62 mm	DIP	Phosphor Bronze	Polyamide (PA46) Nylon 4/6
Aries Electronics 14-81000-610C	UL94 V-0	14	Gold	Through Hole	3 A	0.1 in	2.54 mm	Solder		0.25 çm	10 çin	Closed Frame Elevated	0.14 in	3.56 mm	2.54 mm	0.1 in	0.76 Ám	30 Áin	0.6 in	15.24 mm	DIP	Beryllium Copper	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	105 ░C	-55 °C	Brass

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	51	$ 9.48

Description

General part information

14-810 Series

14 (2 x 7) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources