W66BL6NBUAFJ TR

Winbond Electronics

IC DRAM 2GBIT LVSTL 11 200WFBGA

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Winbond Electronics

IC DRAM 2GBIT LVSTL 11 200WFBGA

Technical Specifications

Parameters and characteristics for this part

Part	Memory Size	Memory Format	Write Cycle Time - Word, Page	Memory Organization	Voltage - Supply [Min]	Voltage - Supply [Max]	Memory Type	Supplier Device Package	Technology	Clock Frequency	Package / Case	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type
Winbond Electronics W66BL6NBUAHJ TR	2 Gbit	DRAM	18 ns	128 M	1.06 V 1.7 V	1.17 V 1.95 V	Volatile	200-WFBGA (10x14.5)	SDRAM - Mobile LPDDR4	2.133 GHz	200-WFBGA	105 °C	-40 °C	Surface Mount
Winbond Electronics W66BL6NBUAFJ TR	2 Gbit	DRAM	18 ns	128 M	1.06 V 1.7 V	1.17 V 1.95 V	Volatile	200-WFBGA (10x14.5)	SDRAM - Mobile LPDDR4	1.6 GHz	200-WFBGA	105 °C	-40 °C	Surface Mount
Winbond Electronics W66BL6NBUAHJ	2 Gbit	DRAM	18 ns	128 M	1.06 V 1.7 V	1.17 V 1.95 V	Volatile	200-WFBGA (10x14.5)	SDRAM - Mobile LPDDR4	2.133 GHz	200-WFBGA	105 °C	-40 °C	Surface Mount
Winbond Electronics W66BL6NBUAGJ TR	2 Gbit	DRAM	18 ns	128 M	1.06 V 1.7 V	1.17 V 1.95 V	Volatile	200-WFBGA (10x14.5)	SDRAM - Mobile LPDDR4	1866 MHz	200-WFBGA	105 °C	-40 °C	Surface Mount

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tape & Reel (TR)	2500	$ 5.25

General part information

SDRAM - Mobile LPDDR4 Memory IC 2Gbit LVSTL_11 1.6 GHz 3.5 ns 200-WFBGA (10x14.5)

Technical documentation and resources