H3155-01

Active

Harwin Inc.

SUB-MINIATURE SOCKET, 1POS, SOLDER

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Active

Harwin Inc.

SUB-MINIATURE SOCKET, 1POS, SOLDER

Technical Specifications

Parameters and characteristics for this part

Specification	H3155-01

Accepts Pin Diameter [Max]	0.51 mm
Accepts Pin Diameter [Max]	0.02 in
Accepts Pin Diameter [Min]	0.46 mm
Accepts Pin Diameter [Min]	0.018 in
Contact Finish	Gold
Contact Material	Beryllium Copper
Flange Diameter [diameter]	1.45 mm
Flange Diameter [diameter]	0.057 in
Insertion Force [Max]	6 N
Insertion Force [Min]	2 N
Length - Overall [x]	0.142 in
Length - Overall [x]	3.61 mm
Mounting Hole Diameter [Max] [diameter]	1.09 mm
Mounting Hole Diameter [Max] [diameter]	0.043 in
Mounting Hole Diameter [Min] [diameter]	0.039 in
Mounting Hole Diameter [Min] [diameter]	0.99 mm
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Socket Depth [z]	3.15 mm
Socket Depth [z]	0.124 "
Tail Type	No Tail
Termination	Solder

Part	Accepts Pin Diameter [Min]	Accepts Pin Diameter [Max]	Accepts Pin Diameter [Min]	Accepts Pin Diameter [Max]	Insertion Force [Min]	Insertion Force [Max]	Termination	Mounting Hole Diameter [Min] [diameter]	Mounting Hole Diameter [Min] [diameter]	Mounting Hole Diameter [Max] [diameter]	Mounting Hole Diameter [Max] [diameter]	Socket Depth [z]	Socket Depth [z]	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material	Flange Diameter [diameter]	Flange Diameter [diameter]	Tail Type	Length - Overall [x]	Length - Overall [x]	Contact Finish
Harwin Inc. H3155-01	0.46 mm	0.51 mm	0.018 in	0.02 in	2 N	6 N	Solder	0.039 in	0.99 mm	1.09 mm	0.043 in	3.15 mm	0.124 "	-55 °C	125 °C	Beryllium Copper	1.45 mm	0.057 in	No Tail	0.142 in	3.61 mm	Gold

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly