
BDN17-3CB/A01
ActiveTusonix a Subsidiary of CTS Electronic Components
HEATSINK CPU W/ADHESIVE 1.71"SQ
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BDN17-3CB/A01
ActiveTusonix a Subsidiary of CTS Electronic Components
HEATSINK CPU W/ADHESIVE 1.71"SQ
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | BDN17-3CB/A01 |
|---|---|
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Fin Height | 9.02 mm |
| Fin Height | 0.355 in |
| Length | 43.43 mm |
| Length | 1.71 " |
| Material | Aluminum |
| Material Finish | Black Anodized |
| Package Cooled | ASIC, BGA, LGA, CPU |
| Shape | Square, Pin Fins |
| Shelf Life | 24 Months |
| Thermal Resistance @ Forced Air Flow | 3.8 °C/W, 400 LFM |
| Thermal Resistance @ Natural | 11.5 °C/W |
| Type | Top Mount |
| Width [x] | 1.71 in |
| Width [x] | 43.43 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 1000 | $ 3.28 | |
Description
General part information
BDN17 Series
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
Documents
Technical documentation and resources