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BDN17-3CB/A01 - BDN17-3CB/A01

BDN17-3CB/A01

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Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.71"SQ

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BDN17-3CB/A01 - BDN17-3CB/A01

BDN17-3CB/A01

Active
Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.71"SQ

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationBDN17-3CB/A01
Attachment MethodThermal Tape, Adhesive (Included)
Fin Height9.02 mm
Fin Height0.355 in
Length43.43 mm
Length1.71 "
MaterialAluminum
Material FinishBlack Anodized
Package CooledASIC, BGA, LGA, CPU
ShapeSquare, Pin Fins
Shelf Life24 Months
Thermal Resistance @ Forced Air Flow3.8 °C/W, 400 LFM
Thermal Resistance @ Natural11.5 °C/W
TypeTop Mount
Width [x]1.71 in
Width [x]43.43 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 1000$ 3.28

Description

General part information

BDN17 Series

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Documents

Technical documentation and resources