96-7068-8832

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Kester Solder

SOLDER FLUX-CORED/245 .031" 500

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Active

Kester Solder

SOLDER FLUX-CORED/245 .031" 500

Technical Specifications

Parameters and characteristics for this part

Specification	96-7068-8832

Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Flux Type	No-Clean
Form	Spool
Form	17.64 oz, 500 g
Melting Point [Max]	218 °C
Melting Point [Max]	424 °F
Melting Point [Min]	217 °C
Melting Point [Min]	423 °F
Storage/Refrigeration Temperature [Max]	40 °C
Storage/Refrigeration Temperature [Min]	10 °C
Type	Wire Solder
Wire Gauge	20 AWG, 22 SWG

Part	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Melting Point [Min]	Melting Point [Min]	Melting Point [Max]	Melting Point [Max]	Flux Type	Form	Form	Wire Gauge	Type	Composition	Wire Gauge	Diameter [diameter]	Diameter [diameter]
Kester Solder 96-7068-8832	10 °C	40 °C	217 °C	423 °F	218 °C	424 °F	No-Clean	Spool	17.64 oz 500 g	20 AWG 22 SWG	Wire Solder	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Kester Solder 96-7068-8820	10 °C	40 °C	217 °C	423 °F	218 °C	424 °F	No-Clean	Spool	17.64 oz 500 g		Wire Solder	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	24 AWG 25 mmý	0.51 mm	0.02 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 20 AWG, 22 SWG Spool, 17.64 oz (500g)

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