M2S090S-1FG676I

Obsolete

Microsemi Corporation

IC SOC CORTEX-M3 166MHZ 676FBGA

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Obsolete

Microsemi Corporation

IC SOC CORTEX-M3 166MHZ 676FBGA

Technical Specifications

Parameters and characteristics for this part

Specification	M2S090S-1FG676I

Architecture	MCU, FPGA
Connectivity	CANbus, USB, Ethernet, SPI, UART/USART, I2C
Core Processor	ARM® Cortex®-M3
Flash Size	512 KB
Number of I/O	425
Operating Temperature [Max]	100 °C
Operating Temperature [Min]	-40 C
Package / Case	676-BGA
Peripherals	DDR, PCIe, SERDES
Primary Attributes	FPGA - 90K Logic Modules
RAM Size	64 KB
Speed	166 MHz
Supplier Device Package	676-FBGA (27x27)

Part	Package / Case	Number of I/O	Flash Size	Connectivity	Operating Temperature [Max]	Operating Temperature [Min]	Speed	Peripherals	Core Processor	Architecture	RAM Size	Primary Attributes	Supplier Device Package
Microsemi Corporation M2S090S-1FG676I	676-BGA	425	512 KB	CANbus Ethernet I2C SPI UART/USART USB	100 °C	-40 C	166 MHz	DDR PCIe SERDES	ARM® Cortex®-M3	MCU FPGA	64 KB	FPGA - 90K Logic Modules	676-FBGA (27x27)
Microsemi Corporation M2S090S-1FG484I	484-BGA	267 I/O	512 KB	CANbus Ethernet I2C SPI UART/USART USB	100 °C	-40 C	166 MHz	DDR PCIe SERDES	ARM® Cortex®-M3	MCU FPGA	64 KB	FPGA - 90K Logic Modules	484-FPBGA (23x23)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 90K Logic Modules 166MHz 676-FBGA (27x27)

Technical documentation and resources