MTB1-38SAL56-01

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ITT Cannon, LLC

CONN 38POS 0.05 GOLD PCB R/A

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MTB1-38SAL56-01

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ITT Cannon, LLC

CONN 38POS 0.05 GOLD PCB R/A

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	MTB1-38SAL56-01

Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	1.27 µm
Contact Finish Thickness - Mating	50 µin
Contact Material	Copper Alloy
Contact Shape	Circular
Contact Type	Socket
Current Rating (Amps)	3 A
Features	Guide Pin
Insulation Material	Diallyl Phthalate (DAP)
Mounting Type	Through Hole, Right Angle
Number of Positions	38
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature [Max]	150 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.05 in
Pitch - Mating	1.27 mm
Style	Board to Board, Cable
Termination	Solder

MTB1 Series

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Part	Termination	Number of Positions	Connector Type	Pitch - Mating	Pitch - Mating	Insulation Material	Contact Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Style	Mounting Type	Insulation Height	Insulation Height	Number of Positions Loaded	Shrouding	Contact Shape	Number of Rows	Fastening Type	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Type	Features	Wire Type	Cable Termination	Contact Finish Thickness	Contact Finish Thickness	Pitch [x]	Pitch [x]	Contact Finish	Wire Gauge [Max]	Wire Gauge [Min]	Length [x]	Length [x]	Color	Pitch - Connector	Pitch - Connector	Shielding	Number of Positions
ITT Cannon, LLC MTB1-6PL95	Solder	6	Header	0.05 in	1.27 mm	Diallyl Phthalate (DAP)	Copper Alloy	1.27 µm	50 µin	3 A	Board to Cable/Wire	Through Hole	0.1 in	2.54 mm	All	Unshrouded	Circular	1	Push-Pull	Gold	-55 °C	150 °C	Male Pin
ITT Cannon, LLC MTB1-10PAL1-01	Solder	10	Header	0.05 in	1.27 mm	Diallyl Phthalate (DAP)	Copper Alloy	1.27 µm	50 µin	3 A	Board to Cable/Wire	Through Hole Right Angle	0.1 in	2.54 mm	All	Unshrouded	Circular	1	Push-Pull	Gold	-55 °C	150 °C	Male Pin	Guide Pin
ITT Cannon, LLC MTB1-5PS1												Free Hanging (In-Line)						1	Push-Pull				Male Pin		Discrete	Solder	50 µin	1.27 µm	0.05 in	1.27 mm	Gold	32 AWG	24 AWG
ITT Cannon, LLC MTB1-81PL1	Solder	8	Header	0.05 in	1.27 mm	Diallyl Phthalate (DAP)	Copper Alloy	1.27 µm	50 µin	3 A	Board to Cable/Wire	Through Hole	0.1 in	2.54 mm	All	Unshrouded	Circular	1	Push-Pull	Gold	-55 °C	150 °C	Male Pin
ITT Cannon, LLC MTB1-2PH003		2	Plug to Individual Wire Leads																							Crimp	50 µin	1.27 µm			Gold			457.2 mm	1.5 ft	Individual Multiple	0.05 in	1.27 mm	Unshielded
ITT Cannon, LLC MTB1-32PL1	Solder		Header	0.05 in	1.27 mm	Diallyl Phthalate (DAP)	Copper Alloy	1.27 µm	50 µin	3 A	Board to Cable/Wire	Through Hole	0.1 in	2.54 mm	All	Unshrouded	Circular	1	Push-Pull	Gold	-55 °C	150 °C	Male Pin
ITT Cannon, LLC MTB1-16SAL1-01	Solder			0.05 in	1.27 mm	Diallyl Phthalate (DAP)	Copper Alloy	1.27 µm	50 µin	3 A	Board to Board Cable	Through Hole Right Angle			All		Circular	1		Gold	-55 °C	150 °C	Socket	Guide Pin																16
ITT Cannon, LLC MTB1-16PAL79	Solder		Header	0.05 in	1.27 mm	Diallyl Phthalate (DAP)	Copper Alloy	1.27 µm	50 µin	3 A	Board to Cable/Wire	Through Hole Right Angle	0.1 in	2.54 mm	All	Unshrouded	Circular	1	Push-Pull	Gold	-55 °C	150 °C	Male Pin																	16
ITT Cannon, LLC MTB1-38SAL56-01	Solder	38		0.05 in	1.27 mm	Diallyl Phthalate (DAP)	Copper Alloy	1.27 µm	50 µin	3 A	Board to Board Cable	Through Hole Right Angle			All		Circular	1		Gold	-55 °C	150 °C	Socket	Guide Pin
ITT Cannon, LLC MTB120SH01110FR022		20	Socket to Individual Wire Leads																							Crimp	50 µin	1.27 µm			Gold			914.4 mm	3 ft	Individual Yellow	0.05 in	1.27 mm	Unshielded

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	10	$ 144.22
Newark	Each	10	$ 136.38
		25	$ 130.89
		50	$ 123.57
		100	$ 121.74

Description

General part information

MTB1 Series

38 Position Connector 0.050" (1.27mm) Through Hole, Right Angle Gold

Documents

Technical documentation and resources