36-6574-18
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 36POS TIN
Deep-Dive with AI
Search across all available documentation for this part.
DocumentsDatasheet
36-6574-18
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 36POS TIN
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 36-6574-18 |
|---|---|
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 5.08 µm |
| Contact Finish Thickness - Mating | 200 µin |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 36 |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 0.11 in |
| Termination Post Length | 2.78 mm |
| Type | 15.24 mm |
| Type | DIP, ZIF (ZIP) |
| Type | 0.6 " |
36-6574 Series
| Part | Number of Positions or Pins (Grid) | Termination | Pitch - Mating | Pitch - Mating | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Material Flammability Rating | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Contact Finish - Post | Contact Material - Post | Mounting Type | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Housing Material | Current Rating (Amps) | Type | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 36 | Solder | 0.1 in | 2.54 mm | Closed Frame | 200 µin | 5.08 µm | UL94 V-0 | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Tin | Beryllium Copper | Through Hole | Beryllium Copper | 5.08 µm | 200 µin | Polyphenylene Sulfide (PPS) Glass Filled | 1 A | 15.24 mm | DIP ZIF (ZIP) | 0.6 " |
Aries Electronics | 36 | Solder | 0.1 in | 2.54 mm | Closed Frame | 200 µin | 5.08 µm | UL94 V-0 | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Tin | Beryllium Copper | Through Hole | Beryllium Copper | 5.08 µm | 200 µin | Polyphenylene Sulfide (PPS) Glass Filled | 1 A | 15.24 mm | DIP ZIF (ZIP) | 0.6 " |
Aries Electronics | 36 | Solder | 0.1 in | 2.54 mm | Closed Frame | 200 µin | 5.08 µm | UL94 V-0 | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Tin | Beryllium Copper | Through Hole | Beryllium Copper | 5.08 µm | 200 µin | Polyphenylene Sulfide (PPS) Glass Filled | 1 A | 15.24 mm | DIP ZIF (ZIP) | 0.6 " |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 3 | $ 149.38 | |
Description
General part information
36-6574 Series
36 (2 x 18) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Tin Through Hole
Documents
Technical documentation and resources