Zenode.ai Logo
Beta
K
BU200Z-178-HT - BU200Z-178-HT

BU200Z-178-HT

Obsolete
On Shore Technology Inc.

CONN IC DIP SOCKET 20POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet
BU200Z-178-HT - BU200Z-178-HT

BU200Z-178-HT

Obsolete
On Shore Technology Inc.

CONN IC DIP SOCKET 20POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationBU200Z-178-HT
Contact Finish - MatingGold
Contact Finish - PostCopper
Contact Finish Thickness - Mating78.7 µin
Contact Finish Thickness - Mating2 µm
Contact Finish Thickness - PostFlash
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Contact Resistance7 mOhm
Current Rating (Amps)1 A
FeaturesOpen Frame
Housing MaterialPolybutylene Terephthalate (PBT), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeSurface Mount
Number of Positions or Pins (Grid)20
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length [x]1.5 mm
Termination Post Length [x]0.059 in
Type0.3 "
Type7.62 mm
TypeDIP

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

Description

General part information

BU200Z Series

20 (2 x 10) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Surface Mount

Documents

Technical documentation and resources