BDN13-3CB/A01

Active

Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.31"SQ

Search across all available documentation for this part.

Active

Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.31"SQ

Technical Specifications

Parameters and characteristics for this part

Specification	BDN13-3CB/A01

Attachment Method	Thermal Tape, Adhesive (Included)
Fin Height	9.02 mm
Fin Height	0.355 in
Length	33.27 mm
Length	1.31 in
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC, BGA, LGA, CPU
Shape	Square, Pin Fins
Shelf Life	24 Months
Thermal Resistance @ Forced Air Flow	400 LFM, 6 °C/W
Thermal Resistance @ Natural	16.1 °C/W
Type	Top Mount
Width [y]	1.31 in
Width [y]	33.27 mm

Part	Attachment Method	Width [y]	Width [y]	Material Finish	Package Cooled	Fin Height	Fin Height	Shape	Material	Type	Length	Length	Thermal Resistance @ Natural	Shelf Life	Thermal Resistance @ Forced Air Flow
Tusonix a Subsidiary of CTS Electronic Components BDN13-3CB/A01	Thermal Tape Adhesive (Included)	1.31 in	33.27 mm	Black Anodized	ASIC BGA CPU LGA	9.02 mm	0.355 in	Pin Fins Square	Aluminum	Top Mount	33.27 mm	1.31 in	16.1 °C/W	24 Months	6 °C/W 400 LFM

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Technical documentation and resources