D8864-42

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Harwin Inc.

CONN IC DIP SOCKET 64POS GOLD

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Harwin Inc.

CONN IC DIP SOCKET 64POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	D8864-42

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	Flash
Contact Finish Thickness - Post	196.9 µin
Contact Finish Thickness - Post	5 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Contact Resistance	10 mOhm
Current Rating (Amps)	1 A
Features	Open Frame
Housing Material	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	64
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.07 in
Pitch - Mating	1.78 mm
Pitch - Post	0.07 in
Pitch - Post	1.78 mm
Termination	Solder
Termination Post Length	3.2 mm
Termination Post Length	0.126 in
Type	DIP
Type	0.75 in
Type	19.05 mm

Part	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Type	Type	Type	Material Flammability Rating	Operating Temperature [Min]	Operating Temperature [Max]	Termination Post Length	Termination Post Length	Features	Contact Resistance	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Contact Finish - Mating	Termination	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Housing Material	Pitch - Post	Pitch - Post	Mounting Type	Contact Finish - Post
Harwin Inc. D8864-42	1 A	0.07 in	1.78 mm	DIP	0.75 in	19.05 mm	UL94 V-0	-55 °C	125 °C	3.2 mm	0.126 in	Open Frame	10 mOhm	64	196.9 µin	5 µm	Beryllium Copper	Gold	Solder	Brass	Flash	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.07 in	1.78 mm	Through Hole	Tin

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

64 (2 x 32) Pos DIP, 0.75" (19.05mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources