W25X10CLUXIG TR

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Winbond Electronics

IC FLASH 1MBIT SPI 104MHZ 8USON

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W25X10CLUXIG TR

Active

Winbond Electronics

IC FLASH 1MBIT SPI 104MHZ 8USON

Deep-Dive with AI

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	W25X10CLUXIG TR

Clock Frequency	104 MHz
Memory Format	FLASH
Memory Interface	SPI
Memory Organization	128K x 8
Memory Size	1 Mbit
Memory Type	Non-Volatile
Mounting Type	Surface Mount
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-40 °C
Package / Case	8-UFDFN Exposed Pad
Supplier Device Package	8-USON (2x3)
Technology	FLASH
Voltage - Supply [Max]	3.6 V
Voltage - Supply [Min]	2.3 V
Write Cycle Time - Word, Page	800 µs

W25X10 Series

Part	Memory Interface	Clock Frequency	Memory Organization	Mounting Type	Write Cycle Time - Word, Page	Voltage - Supply [Min]	Voltage - Supply [Max]	Operating Temperature [Max]	Operating Temperature [Min]	Supplier Device Package	Memory Format	Technology	Memory Size	Memory Type	Package / Case	Package / Case [y]	Package / Case [x]
Winbond Electronics W25X10AVSNIG	SPI	100 MHz	128K x 8	Surface Mount	3 ms	2.7 V	3.6 V	85 °C	-40 °C	8-SOIC	FLASH	FLASH	1 Mbit	Non-Volatile	8-SOIC	3.9 mm	0.154 in
Winbond Electronics W25X10VSNIG	SPI	75 MHz	128K x 8	Surface Mount	3 ms	2.7 V	3.6 V	85 °C	-40 °C	8-SOIC	FLASH	FLASH	1 Mbit	Non-Volatile	8-SOIC	3.9 mm	0.154 in
Winbond Electronics W25X10CLUXIG TR	SPI	104 MHz	128K x 8	Surface Mount	800 µs	2.3 V	3.6 V	85 °C	-40 °C	8-USON (2x3)	FLASH	FLASH	1 Mbit	Non-Volatile	8-UFDFN Exposed Pad
Winbond Electronics W25X10BVSNIG	SPI	104 MHz	128K x 8	Surface Mount	3 ms	2.7 V	3.6 V	85 °C	-40 °C	8-SOIC	FLASH	FLASH	1 Mbit	Non-Volatile	8-SOIC	3.9 mm	0.154 in
Winbond Electronics W25X10BVZPIG	SPI	104 MHz	128K x 8	Surface Mount	3 ms	2.7 V	3.6 V	85 °C	-40 °C	8-WSON (6x5)	FLASH	FLASH	1 Mbit	Non-Volatile	8-WDFN Exposed Pad
Winbond Electronics W25X10VZPIG	SPI	75 MHz	128K x 8	Surface Mount	3 ms	2.7 V	3.6 V	85 °C	-40 °C	8-WSON (6x5)	FLASH	FLASH	1 Mbit	Non-Volatile	8-WDFN Exposed Pad
Winbond Electronics W25X10CLZPIG	SPI	104 MHz	128K x 8	Surface Mount	800 µs	2.3 V	3.6 V	85 °C	-40 °C	8-WSON (6x5)	FLASH	FLASH	1 Mbit	Non-Volatile	8-WDFN Exposed Pad
Winbond Electronics W25X10CLSNIG	SPI	104 MHz	128K x 8	Surface Mount	800 µs	2.3 V	3.6 V	85 °C	-40 °C	8-SOIC	FLASH	FLASH	1 Mbit	Non-Volatile	8-SOIC	3.9 mm	0.154 in
Winbond Electronics W25X10CLZPIG TR	SPI	104 MHz	128K x 8	Surface Mount	800 µs	2.3 V	3.6 V	85 °C	-40 °C	8-WSON (6x5)	FLASH	FLASH	1 Mbit	Non-Volatile	8-WDFN Exposed Pad

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Cut Tape (CT)	1	$ 0.50
		10	$ 0.45
		25	$ 0.43
		50	$ 0.41
		100	$ 0.40
		250	$ 0.38
		500	$ 0.37
		1000	$ 0.35
	Digi-Reel®	1	$ 0.50
		10	$ 0.45
		25	$ 0.43
		50	$ 0.41
		100	$ 0.40
		250	$ 0.38
		500	$ 0.37
		1000	$ 0.35

Description

General part information

W25X10 Series

FLASH Memory IC 1Mbit SPI 104 MHz 8-USON (2x3)

Documents

Technical documentation and resources