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UMP11NFHTN - Product thumbnail image

UMP11NFHTN

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Rohm Semiconductor

HIGH-SPEED SWITCHING, 80V, 100MA, 2 PAIR ANODE COMMON SWITCHING DIODE FOR AUTOMOTIVE

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Search across all available documentation for this part.

DocumentsPCB Layout Thermal Design GuideNotes for Temperature Measurement Using Thermocouples+29
UMP11NFHTN - Product thumbnail image

UMP11NFHTN

Active
Rohm Semiconductor

HIGH-SPEED SWITCHING, 80V, 100MA, 2 PAIR ANODE COMMON SWITCHING DIODE FOR AUTOMOTIVE

Deep-Dive with AI

DocumentsPCB Layout Thermal Design GuideNotes for Temperature Measurement Using Thermocouples+29

Technical Specifications

Parameters and characteristics for this part

SpecificationUMP11NFHTN
Current - Average Rectified (Io) (per Diode)100 mA
Current - Reverse Leakage @ Vr100 nA
Diode Configuration2 Pair Common Anode
GradeAutomotive
Mounting TypeSurface Mount
Operating Temperature - Junction150 °C
Package / Case6-TSSOP, SC-88, SOT-363
QualificationAEC-Q101
Reverse Recovery Time (trr)4 ns
SpeedAny Speed
Speed200 mA
Supplier Device PackageUMD6
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]80 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.59
10$ 0.36
100$ 0.24
500$ 0.18
1000$ 0.16
Digi-Reel® 1$ 0.59
10$ 0.36
100$ 0.24
500$ 0.18
1000$ 0.16
Tape & Reel (TR) 3000$ 0.15
NewarkEach (Supplied on Cut Tape) 1$ 0.59
10$ 0.42
25$ 0.40
50$ 0.37
100$ 0.34
250$ 0.29
500$ 0.25
1000$ 0.22

Description

General part information

UMP11NFH Series

ROHM's switching diodes, including diode arrays, are available in high-reliability packages and stable supply for various applications.

Documents

Technical documentation and resources

PCB Layout Thermal Design Guide

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Inner Structure

Package Information

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Explanation for Marking

Package Information

Power Loss and Thermal Design of Diodes

Thermal Design

Part Explanation

Application Note

Taping Information

Package Information

UMP11NFH Data Sheet

Data Sheet

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Export Regulations

Export Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

About Flammability of Materials

Environmental Data

What is a Thermal Model? (Diode)

Thermal Design

ESD Data

Characteristics Data

Package Dimensions

Package Information

List of Diode Package Thermal Resistance

Thermal Design

Moisture Sensitivity Level - Diodes

Package Information

What Is Thermal Design

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Reliability Test Result

Manufacturing Data

Diode Types and Applications

Technical Article

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Technical Data Sheet EN

Datasheet