628-65AB

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Wakefield-Vette

HEATSINK CPU 43MM SQ BLK H=.65"

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Active

Wakefield-Vette

HEATSINK CPU 43MM SQ BLK H=.65"

Technical Specifications

Parameters and characteristics for this part

Specification	628-65AB

Attachment Method	Thermal Tape, Adhesive (Not Included)
Fin Height [z]	16.51 mm
Fin Height [z]	0.65 in
Length	44.45 mm
Length	1.75 in
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC, BGA, LGA, CPU
Power Dissipation @ Temperature Rise	20 °C, 3 W
Shape	Square, Pin Fins
Thermal Resistance @ Forced Air Flow	2 °C/W
Type	Top Mount
Width [x]	43.18 mm
Width [x]	1.7 in

Part	Material	Shape	Width [x]	Width [x]	Material Finish	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Type	Attachment Method	Length	Length	Fin Height [z]	Fin Height [z]	Package Cooled
Wakefield-Vette 628-65ABT1E	Aluminum	Pin Fins Square	43.18 mm	1.7 in	Black Anodized	3 W 20 °C	2 °C/W	Top Mount	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	16.51 mm	0.65 in	ASIC BGA CPU LGA
Wakefield-Vette 628-65ABT5	Aluminum	Pin Fins Square	43.18 mm	1.7 in	Black Anodized	3 W 20 °C	2 °C/W	Top Mount	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	16.51 mm	0.65 in	ASIC BGA CPU LGA
Wakefield-Vette 628-65ABT4E	Aluminum	Pin Fins Square	43.18 mm	1.7 in	Black Anodized	3 W 20 °C	2 °C/W	Top Mount	Thermal Tape Adhesive (Included)	44.45 mm	1.75 in	16.51 mm	0.65 in	ASIC BGA CPU LGA
Wakefield-Vette 628-65AB	Aluminum	Pin Fins Square	43.18 mm	1.7 in	Black Anodized	3 W 20 °C	2 °C/W	Top Mount	Thermal Tape Adhesive (Not Included)	44.45 mm	1.75 in	16.51 mm	0.65 in	ASIC BGA CPU LGA

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum 3.0W @ 20°C Top Mount

Technical documentation and resources