529701B02500G

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Boyd Laconia, LLC

HEATSINK TO-218 SOLDER PIN

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Boyd Laconia, LLC

HEATSINK TO-218 SOLDER PIN

Technical Specifications

Parameters and characteristics for this part

Specification	529701B02500G

Attachment Method	PC Pin, Bolt On
Fin Height	1 in
Fin Height	25.4 mm
Length [x]	1 in
Length [x]	25.4 mm
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	TO-218
Power Dissipation @ Temperature Rise	12 W
Shape	Rectangular, Fins
Thermal Resistance @ Forced Air Flow	200 LFM, 4 °C/W
Thermal Resistance @ Natural	5.5 °C/W
Type	Board Level, Vertical
Width [x]	41.91 mm
Width [x]	1.65 in

Part	Material Finish	Type	Length [x]	Length [x]	Shape	Material	Thermal Resistance @ Forced Air Flow	Package Cooled	Attachment Method	Fin Height	Fin Height	Thermal Resistance @ Natural	Power Dissipation @ Temperature Rise	Width [x]	Width [x]
Boyd Laconia, LLC 529701B02500G	Black Anodized	Board Level Vertical	1 in	25.4 mm	Rectangular Fins	Aluminum	4 °C/W 200 LFM	TO-218	Bolt On PC Pin	1 in	25.4 mm	5.5 °C/W	12 W	41.91 mm	1.65 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Heat Sink TO-218 Aluminum 12.0W @ 70°C Board Level, Vertical

Technical documentation and resources