SMD2SWLF.031 8OZ

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Chip Quik Inc.

LF SOLDER WIRE 99.3/0.7 TIN/COPP

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Chip Quik Inc.

LF SOLDER WIRE 99.3/0.7 TIN/COPP

Technical Specifications

Parameters and characteristics for this part

Part	Form	Form	Form	Diameter [diameter]	Diameter [diameter]	Melting Point [custom]	Melting Point [custom]	Composition	Type	Wire Gauge	Flux Type	Form
Chip Quik Inc. SMD2SWLT.047 8OZ	Spool	0.5 lb 8 oz	227 g	1.19 mm	0.047 in	138 °C	280 °F	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	Wire Solder
Chip Quik Inc. SMD2SWLF.031 8OZ	Spool	0.5 lb 8 oz	227 g			227 °C	441 °F	Sn99.3Cu0.7 (99.3/0.7)	Wire Solder	20 AWG 22 SWG	No-Clean Water Soluble
Chip Quik Inc. SMD2SWLF.031 2OZ	Spool	2 oz	56.7 g			227 °C	441 °F	Sn99.3Cu0.7 (99.3/0.7)	Wire Solder		No-Clean Water Soluble
Chip Quik Inc. SMD2SWLT.047 4OZ	Spool	4 oz	113.4 g	1.19 mm	0.047 in	138 °C	280 °F	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	Wire Solder
Chip Quik Inc. SMD2SWLT.040 100G	Spool	3.53 oz	100 g	1.02 mm	0.04 in	138 °C	280 °F	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	Wire Solder		No-Clean Rosin Activated (RA)
Chip Quik Inc. SMD2SWLT.040 20G	Spool	0.7 oz	20 g	1.02 mm	0.04 in	138 °C	280 °F	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	Wire Solder		No-Clean Rosin Activated (RA)
Chip Quik Inc. SMD2SWLT.040 10G	Spool		0.35 oz	1.02 mm	0.04 in	138 °C	280 °F	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	Wire Solder		No-Clean Rosin Activated (RA)	10 g

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 37.64

General part information

Lead Free No-Clean, Water Soluble Wire Solder Sn99.3Cu0.7 (99.3/0.7) 20 AWG, 22 SWG Spool, 8 oz (227g), 1/2 lb

Technical documentation and resources