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RXH100N03TB1 - 8-SOIC

RXH100N03TB1

Active
Rohm Semiconductor

4V DRIVE NCH MOSFET: MOSFETS ARE

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RXH100N03TB1 - 8-SOIC

RXH100N03TB1

Active
Rohm Semiconductor

4V DRIVE NCH MOSFET: MOSFETS ARE

Technical Specifications

Parameters and characteristics for this part

SpecificationRXH100N03TB1
Current - Continuous Drain (Id) @ 25°C10 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On) [Max]4 V
Drive Voltage (Max Rds On, Min Rds On) [Min]10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs11 nC
Input Capacitance (Ciss) (Max) @ Vds800 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-SOIC
Package / Case [x]0.154 in
Package / Case [y]3.9 mm
Power Dissipation (Max) [Max]2 W
Rds On (Max) @ Id, Vgs13 mOhm
Supplier Device Package8-SOP
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id [Max]2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.09
10$ 1.34
100$ 0.91
500$ 0.72
1000$ 0.66
Digi-Reel® 1$ 2.09
10$ 1.34
100$ 0.91
500$ 0.72
1000$ 0.66
Tape & Reel (TR) 2500$ 0.55

Description

General part information

RXH100N03 Series

MOSFETs are made as ultra-low ON-resistance by the micro-processing technologies suitable for mobile equipment for low current consumption. In wide lineup including compact type, high-power type and complex type to meet in the market.

Documents

Technical documentation and resources

What is a Thermal Model? (Transistor)

Thermal Design

Explanation for Marking

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Taping Information

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Reliability Test Result

Manufacturing Data

What Is Thermal Design

Thermal Design

Package Dimensions

Package Information

How to Create Symbols for PSpice Models

Models

About Flammability of Materials

Environmental Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Types and Features of Transistors

Application Note

List of Transistor Package Thermal Resistance

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

Inner Structure

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Part Explanation

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Export Regulations

Export Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

ESD Data

Characteristics Data

Constitution Materials List

Environmental Data