W63AH6NBVADE

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Winbond Electronics

IC DRAM 1GBIT HSUL 12 178VFBGA

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Winbond Electronics

IC DRAM 1GBIT HSUL 12 178VFBGA

Technical Specifications

Parameters and characteristics for this part

Part	Memory Size	Clock Frequency	Memory Interface	Operating Temperature [Min]	Operating Temperature [Max]	Memory Type	Package / Case	Access Time	Memory Organization	Memory Format	Mounting Type	Supplier Device Package	Supplier Device Package [y]	Supplier Device Package [x]	Voltage - Supply [Min]	Voltage - Supply [Max]	Write Cycle Time - Word, Page	Technology
Winbond Electronics W63AH6NBVABE TR	1 Mbit	800 MHz	HSUL_12	-25 °C	85 °C	Volatile	178-VFBGA	5.5 ns	64 M	DRAM	Surface Mount	178-VFBGA	11.5	11	1.14 V 1.7 V	1.3 V 1.95 V	15 ns	SDRAM - Mobile LPDDR3
Winbond Electronics W63AH6NBVADE	1 Mbit	1066 MHz	HSUL_12	-25 °C	85 °C	Volatile	178-VFBGA		64 M	DRAM	Surface Mount	178-VFBGA	11.5	11	1.14 V 1.7 V	1.3 V 1.95 V	15 ns	SDRAM - Mobile LPDDR3
Winbond Electronics W63AH6NBVABI	1 Mbit	800 MHz	HSUL_12	-40 °C	85 °C	Volatile	178-VFBGA	5.5 ns	64 M	DRAM	Surface Mount	178-VFBGA	11.5	11	1.14 V 1.7 V	1.3 V 1.95 V	15 ns	SDRAM - Mobile LPDDR3

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	189	$ 3.80

General part information

SDRAM - Mobile LPDDR3 Memory IC 1Gbit HSUL_12 1.066 GHz 178-VFBGA (11x11.5)

Technical documentation and resources