SIP050-1X32-160BLF

Obsolete

Amphenol ICC (FCI)

CONN SOCKET SIP 32POS GOLD

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SIP050-1X32-160BLF

Obsolete

Amphenol ICC (FCI)

CONN SOCKET SIP 32POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	SIP050-1X32-160BLF

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Features	Closed Frame
Housing Material	Glass Filled, Polyester, Polycyclohexylenedimethylene Terephthalate (PCT)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	1 x 32
Number of Positions or Pins (Grid) [custom]	32
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	2.41 mm
Termination Post Length	0.095 in
Type	SIP

SIP050 Series

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Material Flammability Rating	Mounting Type	Termination	Contact Material - Mating	Type	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Pitch - Post	Pitch - Post	Contact Finish - Post	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Amphenol ICC (FCI) SIP050-1X09-157B	200 µin	5.08 µm	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	2.41 mm	0.095 in	UL94 V-0	Through Hole	Solder	Beryllium Copper	SIP	Brass	5.08 µm	200 µin	Closed Frame	2.54 mm	0.1 in	Tin	9
Amphenol ICC (FCI) SIP050-1X32-157B	200 µin	5.08 µm	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	2.41 mm	0.095 in	UL94 V-0	Through Hole	Solder	Beryllium Copper	SIP	Brass	5.08 µm	200 µin	Closed Frame	2.54 mm	0.1 in	Tin		1 x 32	32
Amphenol ICC (FCI) SIP050-1X32-160BLF	200 µin	5.08 µm	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	2.41 mm	0.095 in	UL94 V-0	Through Hole	Solder	Beryllium Copper	SIP	Brass	0.76 Ám	30 Áin	Closed Frame	2.54 mm	0.1 in	Tin		1 x 32	32	Gold
Amphenol ICC (FCI) SIP050-1X31-160BLF	200 µin	5.08 µm	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	2.41 mm	0.095 in	UL94 V-0	Through Hole	Solder	Beryllium Copper	SIP	Brass	0.76 Ám	30 Áin	Closed Frame	2.54 mm	0.1 in	Tin	31			Gold
Amphenol ICC (FCI) SIP050-1X11-160B	200 µin	5.08 µm	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	2.41 mm	0.095 in	UL94 V-0	Through Hole	Solder	Beryllium Copper	SIP	Brass	0.76 Ám	30 Áin	Closed Frame	2.54 mm	0.1 in	Tin	11			Gold
Amphenol ICC (FCI) SIP050-1X12-157BLF	200 µin	5.08 µm	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	2.41 mm	0.095 in	UL94 V-0	Through Hole	Solder	Beryllium Copper	SIP	Brass	5.08 µm	200 µin	Closed Frame	2.54 mm	0.1 in	Tin	12				1 x 12
Amphenol ICC (FCI) SIP050-1X28-157BLF	200 µin	5.08 µm	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	2.41 mm	0.095 in	UL94 V-0	Through Hole	Solder	Beryllium Copper	SIP	Brass	5.08 µm	200 µin	Closed Frame	2.54 mm	0.1 in	Tin	28					28	1
Amphenol ICC (FCI) SIP050-1X26-157BLF	200 µin	5.08 µm	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	2.41 mm	0.095 in	UL94 V-0	Through Hole	Solder	Beryllium Copper	SIP	Brass	5.08 µm	200 µin	Closed Frame	2.54 mm	0.1 in	Tin	26
Amphenol ICC (FCI) SIP050-1X13-160B	200 µin	5.08 µm	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	2.41 mm	0.095 in	UL94 V-0	Through Hole	Solder	Beryllium Copper	SIP	Brass	0.76 Ám	30 Áin	Closed Frame	2.54 mm	0.1 in	Tin	13			Gold
Amphenol ICC (FCI) SIP050-1X21-157B	200 µin	5.08 µm	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	0.1 in	2.54 mm	2.41 mm	0.095 in	UL94 V-0	Through Hole	Solder	Beryllium Copper	SIP	Brass	5.08 µm	200 µin	Closed Frame	2.54 mm	0.1 in	Tin	21

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

SIP050 Series

32 (1 x 32) Pos SIP Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available