550-10-520M31-001152

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PRECI-DIP SA

BGA SOLDER TAIL

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550-10-520M31-001152

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PRECI-DIP SA

BGA SOLDER TAIL

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Technical Specifications

Parameters and characteristics for this part

Specification	550-10-520M31-001152

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Brass
Contact Material - Post [custom]	Brass
Contact Resistance	10 mOhm
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	FR4 Epoxy Glass
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	520
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.05 in
Pitch - Mating	1.27 mm
Pitch - Post	1.27 mm
Pitch - Post	0.05 in
Termination	Solder
Termination Post Length [x]	2.2 mm
Termination Post Length [x]	0.086 in
Type	BGA

550-10 Series

Part	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Current Rating (Amps)	Housing Material	Contact Material - Mating	Features	Mounting Type	Termination Post Length [x]	Termination Post Length [x]	Contact Material - Post [custom]	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Number of Positions or Pins (Grid)	Operating Temperature [Min]	Operating Temperature [Max]	Contact Resistance	Termination	Number of Positions or Pins (Grid) [custom]	Termination Post Length	Termination Post Length	Pitch - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]
PRECI-DIP SA 550-10-256M20-001152	1.27 mm	0.05 in	10 çin	0.25 çm	BGA	10 çin	0.25 çm	Gold	1 A	FR4 Epoxy Glass	Brass	Closed Frame	Through Hole	2.2 mm	0.086 in	Brass	Gold	0.05 in	1.27 mm	UL94 V-0	256	-55 °C	125 °C	10 mOhm	Solder
PRECI-DIP SA 550-10-361-18-101135	1.27 mm	0.05 in	10 çin	0.25 çm	PGA	10 çin	0.25 çm	Gold	1 A	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Beryllium Copper	Open Frame	Through Hole			Brass	Gold	0.05 in	1.27 mm	UL94 V-0		-55 °C	125 °C	10 mOhm	Solder	361	3.2 mm	0.126 in
PRECI-DIP SA 550-10-381-18-101135	1.27 mm	0.05 in	10 çin	0.25 çm	PGA	10 çin	0.25 çm	Gold	1 A	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Beryllium Copper	Open Frame	Through Hole			Brass	Gold	0.05 in	1.27 mm	UL94 V-0	381	-55 °C	125 °C	10 mOhm	Solder		3.2 mm	0.126 in
PRECI-DIP SA 550-10-068-10-061101	2.54 mm	0.1 in	10 çin	0.25 çm	PGA	10 çin	0.25 çm	Gold	1 A	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Beryllium Copper	Open Frame	Through Hole			Brass	Gold	2.54 mm		UL94 V-0	68	-55 °C	125 °C	10 mOhm	Solder		4.16 mm	0.164 in	0.1 in
PRECI-DIP SA 550-10-272M20-001166	1.27 mm	0.05 in	10 çin	0.25 çm	BGA	10 çin	0.25 çm	Gold	1 A	FR4 Epoxy Glass	Beryllium Copper	Closed Frame	Through Hole	2.5 mm	0.098 in	Brass	Gold	0.05 in	1.27 mm	UL94 V-0	272	-55 °C	125 °C	10 mOhm	Solder					20 x 20
PRECI-DIP SA 550-10-520M31-001152	1.27 mm	0.05 in	10 çin	0.25 çm	BGA	10 çin	0.25 çm	Gold	1 A	FR4 Epoxy Glass	Brass	Closed Frame	Through Hole	2.2 mm	0.086 in	Brass	Gold	0.05 in	1.27 mm	UL94 V-0	520	-55 °C	125 °C	10 mOhm	Solder
PRECI-DIP SA 550-10-272M20-001152	1.27 mm	0.05 in	10 çin	0.25 çm	BGA	10 çin	0.25 çm	Gold	1 A	FR4 Epoxy Glass	Brass	Closed Frame	Through Hole	2.2 mm	0.086 in	Brass	Gold	0.05 in	1.27 mm	UL94 V-0	272	-55 °C	125 °C	10 mOhm	Solder					20 x 20
PRECI-DIP SA 550-10-037-10-061101	2.54 mm	0.1 in	10 çin	0.25 çm	PGA	10 çin	0.25 çm	Gold	1 A	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Beryllium Copper	Open Frame	Through Hole			Brass	Gold	2.54 mm		UL94 V-0	37	-55 °C	125 °C	10 mOhm	Solder		4.16 mm	0.164 in	0.1 in		10	10
PRECI-DIP SA 550-10-100-15-001101	2.54 mm	0.1 in	10 çin	0.25 çm	PGA	10 çin	0.25 çm	Gold	1 A	Glass Filled Polycyclohexylenedimethylene Terephthalate (PCT) Polyester	Beryllium Copper	Open Frame	Through Hole			Brass	Gold	2.54 mm		UL94 V-0	100	-55 °C	125 °C	10 mOhm	Solder		4.16 mm	0.164 in	0.1 in	15 x 15
PRECI-DIP SA 550-10-520M31-001166	1.27 mm	0.05 in	10 çin	0.25 çm	BGA	10 çin	0.25 çm	Gold	1 A	FR4 Epoxy Glass	Beryllium Copper	Closed Frame	Through Hole	2.5 mm	0.098 in	Brass	Gold	0.05 in	1.27 mm	UL94 V-0	520	-55 °C	125 °C	10 mOhm	Solder

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	288	$ 70.61

Description

General part information

550-10 Series

520 (31 x 31) Pos BGA Socket Gold Through Hole

Documents

Technical documentation and resources

No documents available