109X6512A2016

Obsolete

Sanyo Denki America Inc.

P3, 800MHZ, FC-PGA

Search across all available documentation for this part.

Obsolete

Sanyo Denki America Inc.

P3, 800MHZ, FC-PGA

Technical Specifications

Parameters and characteristics for this part

Specification	109X6512A2016

Attachment Method	Clip
Fin Height	31 mm
Fin Height	1.22 in
Material	Aluminum, Plastic
Package Cooled	Pentium® III (Thin)
Shape	Rectangular
Thermal Resistance @ Forced Air Flow	1.15 °C/W
Type	Board Level
Width [x]	2 in
Width [x]	50.8 mm

Part	Width [x]	Width [x]	Type	Package Cooled	Thermal Resistance @ Forced Air Flow	Shape	Material	Attachment Method	Fin Height	Fin Height
Sanyo Denki America Inc. 109X6512A2016	2 in	50.8 mm	Board Level	Pentium® III (Thin)	1.15 °C/W	Rectangular	Aluminum Plastic	Clip	31 mm	1.22 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

Heat Sink Pentium® III (Thin) Aluminum, Plastic Board Level

Technical documentation and resources