WB100FC120ALZ

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WeEn Semiconductors Co., Ltd

WB100FC120AL/NAU000/NO MARK*CHIP

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WeEn Semiconductors Co., Ltd

WB100FC120AL/NAU000/NO MARK*CHIP

Technical Specifications

Parameters and characteristics for this part

Specification	WB100FC120ALZ

Current - Average Rectified (Io)	100 A
Current - Reverse Leakage @ Vr	250 µA
Mounting Type	Surface Mount
Operating Temperature - Junction	175 °C
Package / Case	Die
Reverse Recovery Time (trr)	90 ns
Speed	200 mA, 500 ns
Supplier Device Package	Wafer
Technology	Standard
Voltage - DC Reverse (Vr) (Max) [Max]	1.2 kV
Voltage - Forward (Vf) (Max) @ If [Max]	3.3 V

Part	Technology	Voltage - Forward (Vf) (Max) @ If [Max]	Reverse Recovery Time (trr)	Supplier Device Package	Operating Temperature - Junction	Mounting Type	Package / Case	Voltage - DC Reverse (Vr) (Max) [Max]	Current - Average Rectified (Io)	Speed	Current - Reverse Leakage @ Vr
WeEn Semiconductors Co., Ltd WB100FC120ALZ	Standard	3.3 V	90 ns	Wafer	175 °C	Surface Mount	Die	1.2 kV	100 A	200 mA 500 ns	250 µA

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	3475	$ 2.45

General part information

Diode 1200 V 100A Surface Mount Wafer

Technical documentation and resources

No documents available