TBL007A-500-20GY

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CUI Devices

TERMINAL BLOCK, SCREWLESS, 5.00,

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CUI Devices

TERMINAL BLOCK, SCREWLESS, 5.00,

Technical Specifications

Parameters and characteristics for this part

Specification	TBL007A-500-20GY

Color	Gray
Contact Material - Plating	Copper Alloy - Tin Plated
Current	15 A
Features	Interlocking (Side)
Mating Orientation	135 °
Mating Orientation	45 °
Mounting Type	Through Hole
Number of Levels	1
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-40 °C
Pitch [x]	5 mm
Pitch [x]	0.197 in
Positions Per Level	20
Voltage	300 V
Wire Gauge [Max]	26 AWG
Wire Gauge [Min]	14 AWG
Wire Termination	Screwless - Spring Cage, Tension Clamp

Part	Voltage	Mating Orientation	Mating Orientation	Operating Temperature [Min]	Operating Temperature [Max]	Wire Termination	Color	Number of Levels	Current	Pitch [x]	Pitch [x]	Wire Gauge [Max]	Wire Gauge [Min]	Positions Per Level	Features	Mounting Type	Contact Material - Plating
CUI Devices TBL007A-500-20GY	300 V	135 °	45 °	-40 °C	105 ░C	Screwless - Spring Cage Tension Clamp	Gray	1	15 A	5 mm	0.197 in	26 AWG	14 AWG	20	Interlocking (Side)	Through Hole	Copper Alloy - Tin Plated
CUI Devices TBL007A-508-02GY	300 V	135 °	45 °	-40 °C	105 ░C	Screwless - Spring Cage Tension Clamp	Gray	1	15 A	5.08 mm	0.2 in	26 AWG	14 AWG	2	Interlocking (Side)	Through Hole	Copper Alloy - Tin Plated
CUI Devices TBL007A-500-04GY	300 V	135 °	45 °	-40 °C	105 ░C	Screwless - Spring Cage Tension Clamp	Gray	1	15 A	5 mm	0.197 in	26 AWG	14 AWG	4	Interlocking (Side)	Through Hole	Copper Alloy - Tin Plated

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

20 Position Wire to Board Terminal Block 45° (135°) Angle with Board 0.197" (5.00mm) Through Hole

Technical documentation and resources