W979H6KBQX2I

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Winbond Electronics

IC DRAM 512MBIT PARA 168WFBGA

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Winbond Electronics

IC DRAM 512MBIT PARA 168WFBGA

Technical Specifications

Parameters and characteristics for this part

Part	Memory Organization	Memory Type	Supplier Device Package	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Write Cycle Time - Word, Page	Memory Size	Package / Case	Technology	Clock Frequency	Memory Format	Voltage - Supply [Min]	Voltage - Supply [Max]	Memory Interface	Supplier Device Package [x]	Supplier Device Package [y]
Winbond Electronics W979H6KBQX2I	32M x 16	Volatile	168-WFBGA (12x12)	85 °C	-40 °C	Surface Mount	15 ns	64 MB	168-WFBGA	SDRAM - Mobile LPDDR2	400 MHz	DRAM	1.14 V	1.95 V	Parallel
Winbond Electronics W979H6KBVX2I	32M x 16	Volatile	134-VFBGA	85 °C	-40 °C	Surface Mount	15 ns	64 MB	134-VFBGA	SDRAM - Mobile LPDDR2	400 MHz	DRAM	1.14 V	1.95 V	Parallel	10	11.5
Winbond Electronics W979H6KBVX2I TR	32M x 16	Volatile	134-VFBGA	85 °C	-40 °C	Surface Mount	15 ns	64 MB	134-VFBGA	SDRAM - Mobile LPDDR2	400 MHz	DRAM	1.14 V	1.95 V	Parallel	10	11.5

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

General part information

SDRAM - Mobile LPDDR2 Memory IC 512Mbit Parallel 400 MHz 168-WFBGA (12x12)

Technical documentation and resources