10-6503-20

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Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

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10-6503-20

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Aries Electronics

CONN IC DIP SOCKET 10POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	10-6503-20

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Phosphor Bronze
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	2 x 5
Number of Positions or Pins (Grid) [custom]	10
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length [x]	0.36 in
Termination Post Length [x]	9.14 mm
Type	DIP
Type	0.6 in
Type	15.24 mm

10-650 Series

Part	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Type	Type	Type	Contact Finish - Post	Current Rating (Amps)	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Termination Post Length	Termination Post Length	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Termination	Housing Material	Pitch - Post	Pitch - Post	Material Flammability Rating	Contact Finish - Mating	Contact Material - Post	Operating Temperature [Max]	Operating Temperature [Min]	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 10-6503-30	2 x 5	10	DIP	0.6 in	15.24 mm	Tin	3 A	Closed Frame	200 µin	5.08 µm	Beryllium Copper	0.5 in	12.7 mm	Through Hole	10 çin	0.25 çm	0.1 in	2.54 mm	Wire Wrap	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	UL94 V-0	Gold	Phosphor Bronze	105 ░C	-55 °C
Aries Electronics 10-6503-21	2 x 5	10	DIP	0.6 in	15.24 mm	Gold	3 A	Closed Frame	10 çin	0.25 çm	Beryllium Copper			Through Hole	10 çin	0.25 çm	0.1 in	2.54 mm	Wire Wrap	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	UL94 V-0	Gold	Phosphor Bronze	125 °C	-55 °C	0.36 in	9.14 mm
Aries Electronics 10-6501-31	2 x 5	10	DIP	0.6 in	15.24 mm	Gold	1.5 A	Closed Frame	10 çin	0.25 çm	Phosphor Bronze	0.69 in	17.52 mm	Through Hole	10 çin	0.25 çm	0.1 in	2.54 mm	Wire Wrap	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	UL94 V-0	Gold	Phosphor Bronze	125 °C	-55 °C
Aries Electronics 10-6501-30	2 x 5	10	DIP	0.6 in	15.24 mm	Tin	1.5 A	Closed Frame	200 µin	5.08 µm	Phosphor Bronze	0.69 in	17.52 mm	Through Hole	200 µin	5.08 µm	0.1 in	2.54 mm	Wire Wrap	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	UL94 V-0		Phosphor Bronze	125 °C	-55 °C
Aries Electronics 10-6503-20	2 x 5	10	DIP	0.6 in	15.24 mm	Tin	3 A	Closed Frame	200 µin	5.08 µm	Beryllium Copper			Through Hole	10 çin	0.25 çm	0.1 in	2.54 mm	Wire Wrap	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	UL94 V-0	Gold	Phosphor Bronze	105 ░C	-55 °C	0.36 in	9.14 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	92	$ 5.22

Description

General part information

10-650 Series

10 (2 x 5) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources