BBL-118-G-E

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Samtec Inc.

CONN HEADER VERT 18POS 2.54MM

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DocumentsDatasheet BBL Through Hole Footprint

BBL-118-G-E

Active

Samtec Inc.

CONN HEADER VERT 18POS 2.54MM

Deep-Dive with AI

DocumentsDatasheet BBL Through Hole Footprint

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	BBL-118-G-E

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Nickel
Contact Finish Thickness - Mating	0.51 µm
Contact Finish Thickness - Mating	20 µin
Contact Finish Thickness - Post	1.27 µm
Contact Finish Thickness - Post	50 µin
Contact Length - Post [x]	3.18 mm
Contact Length - Post [x]	0.125 in
Contact Shape	Circular
Contact Type	Male Pin
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.07 in
Insulation Height	1.78 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Through Hole
Number of Positions	18
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Overall Contact Length	7.62 mm
Overall Contact Length	0.3 in
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Shrouding	Unshrouded
Termination	Solder

BBL-118 Series

Part	Connector Type	Mounting Type	Number of Rows	Number of Positions	Contact Type	Contact Length - Mating [x]	Contact Length - Mating [x]	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Mating	Fastening Type	Termination	Pitch - Mating	Pitch - Mating	Insulation Color	Number of Positions Loaded	Contact Shape	Contact Length - Post [x]	Contact Length - Post [x]	Insulation Height	Insulation Height	Shrouding	Contact Finish - Post	Insulation Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Overall Contact Length	Overall Contact Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Overall Contact Length
Samtec Inc. BBL-118-G-F	Header	Through Hole	1	18	Male Pin	0.122 in	3.1 mm	-55 °C	125 °C	Gold	Push-Pull	Solder	0.1 in	2.54 mm	Black	All	Circular	3.18 mm	0.125 in	0.085 "	2.15 mm	Unshrouded	Nickel	Liquid Crystal Polymer (LCP)	1.27 µm	50 µin	8.43 mm	0.332 in	0.51 µm	20 µin
Samtec Inc. BBL-118-T-E	Header	Through Hole	1	18	Male Pin			-55 °C	125 °C		Push-Pull	Solder	0.1 in	2.54 mm	Black	All	Circular	3.18 mm	0.125 in	0.07 in	1.78 mm	Unshrouded	Nickel	Liquid Crystal Polymer (LCP)	1.27 µm	50 µin		7.62 mm			0.3 in
Samtec Inc. BBL-118-T-F	Header	Through Hole	1	18	Male Pin	0.122 in	3.1 mm	-55 °C	125 °C		Push-Pull	Solder	0.1 in	2.54 mm	Black	All	Circular	3.18 mm	0.125 in	0.085 "	2.15 mm	Unshrouded	Nickel	Liquid Crystal Polymer (LCP)	1.27 µm	50 µin	8.43 mm	0.332 in
Samtec Inc. BBL-118-G-E	Header	Through Hole	1	18	Male Pin			-55 °C	125 °C	Gold	Push-Pull	Solder	0.1 in	2.54 mm	Black	All	Circular	3.18 mm	0.125 in	0.07 in	1.78 mm	Unshrouded	Nickel	Liquid Crystal Polymer (LCP)	1.27 µm	50 µin		7.62 mm	0.51 µm	20 µin	0.3 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 9.74
		10	$ 8.77
		100	$ 7.83
		500	$ 6.56
		1000	$ 5.80

Description

General part information

BBL-118 Series

Connector Header Through Hole 18 position 0.100" (2.54mm)

Documents

Technical documentation and resources

Datasheet

BBL Through Hole Footprint

Datasheet