5PB1110PGGK

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Renesas Electronics Corporation

IC CLK BUF 1:10 200MHZ 20TSSOP

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Renesas Electronics Corporation

IC CLK BUF 1:10 200MHZ 20TSSOP

Technical Specifications

Parameters and characteristics for this part

Part	Number of Circuits	Operating Temperature [Max]	Operating Temperature [Min]	Ratio - Input:Output [custom]	Supplier Device Package	Input	Type	Frequency - Max [Max]	Package / Case	Output	Voltage - Supply [Min]	Voltage - Supply [Max]	Mounting Type	Package / Case [y]	Package / Case [x]
Renesas Electronics Corporation 5PB1110NDG2	1	105 °C	-40 °C	1:10	20-QFN (3x3)	LVCMOS	Fanout Buffer (Distribution)	200 MHz	20-VFQFN Exposed Pad	LVCMOS	1.71 V 2.375 V 3.135 V	1.89 V 2.625 V 3.465 V	Surface Mount
Renesas Electronics Corporation 5PB1110PGGI8	1	85 °C	-40 °C	1:10	20-TSSOP	LVCMOS	Fanout Buffer (Distribution)	200 MHz	20-TSSOP	LVCMOS	1.71 V	3.465 V	Surface Mount	4.4 mm	0.173 in
Renesas Electronics Corporation 5PB1110PGGI	1	85 °C	-40 °C	1:10	20-TSSOP	LVCMOS	Fanout Buffer (Distribution)	200 MHz	20-TSSOP	LVCMOS	1.71 V	3.465 V	Surface Mount	4.4 mm	0.173 in
Renesas Electronics Corporation 5PB1110PGGK	1	85 °C	-40 °C	1:10	20-TSSOP	LVCMOS	Fanout Buffer (Distribution)	200 MHz	20-TSSOP	LVCMOS	1.71 V	3.465 V	Surface Mount	4.4 mm	0.173 in
Renesas Electronics Corporation 5PB1110NDGI	1	85 °C	-40 °C	1:10	20-QFN (3x3)	LVCMOS	Fanout Buffer (Distribution)	200 MHz	20-VFQFN Exposed Pad	LVCMOS	1.71 V	3.465 V	Surface Mount

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Clock Fanout Buffer (Distribution) IC 1:10 200 MHz 20-TSSOP (0.173", 4.40mm Width)

Technical documentation and resources