SMDAL200
ActiveChip Quik Inc.
ALUMINUM SOLDER PASTE WATER-SOLU
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SMDAL200
ActiveChip Quik Inc.
ALUMINUM SOLDER PASTE WATER-SOLU
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | SMDAL200 |
|---|---|
| Composition | Sn96.5Ag3.5 (96.5/3.5) |
| Flux Type | Water Soluble |
| Form | Jar |
| Form | 7.05 oz |
| Form | 200 g |
| Melting Point [custom] | 221 °C |
| Melting Point [custom] | 430 °F |
| Mesh Type | 3 |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 74.55 | |
Description
General part information
SMDAL Series
Lead Free Water Soluble Solder Paste Sn96.5Ag3.5 (96.5/3.5) Jar, 7.05 oz (200g)
Documents
Technical documentation and resources