PA0027C
ActiveChip Quik Inc.
UMAX-10/USOP-10/MSOP-10 TO DIP-1
Deep-Dive with AI
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PA0027C
ActiveChip Quik Inc.
UMAX-10/USOP-10/MSOP-10 TO DIP-1
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | PA0027C |
|---|---|
| Board Thickness | 1.6 mm |
| Board Thickness | 0.063 in |
| Material | FR4 Epoxy Glass |
| Number of Positions | 10 |
| Package Accepted | uSOP, uMAX, MSOP |
| Pitch [x] | 0.5 mm |
| Pitch [x] | 0.02 in |
| Proto Board Type | SMD to DIP |
| Size / Dimension [x] | 12.7 mm |
| Size / Dimension [x] | 0.5 in |
| Size / Dimension [y] | 0.4 in |
| Size / Dimension [y] | 10.16 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 7.09 | |
Description
General part information
PA0027 Series
UMAX-10/USOP-10/MSOP-10 TO DIP-1
Documents
Technical documentation and resources
No documents available