28-3570-10
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 28POS TIN
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28-3570-10
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 28POS TIN
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 28-3570-10 |
|---|---|
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 5.08 µm |
| Contact Finish Thickness - Mating | 200 µin |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 28 |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 0.11 in |
| Termination Post Length | 2.78 mm |
| Type | 7.62 mm |
| Type | 0.3 in |
| Type | DIP, ZIF (ZIP) |
28-3570 Series
| Part | Contact Finish - Mating | Material Flammability Rating | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length | Housing Material | Pitch - Post | Pitch - Post | Mounting Type | Features | Type | Type | Type | Current Rating (Amps) | Contact Material - Mating | Contact Material - Post | Number of Positions or Pins (Grid) | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | UL94 V-0 | 0.1 in | 2.54 mm | Gold | 10 çin | 0.25 çm | 10 çin | 0.25 çm | 0.11 in | 2.78 mm | Polyphenylene Sulfide (PPS) Glass Filled | 2.54 mm | 0.1 in | Through Hole | Closed Frame | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 1 A | Beryllium Copper | Beryllium Copper | 28 | Solder |
Aries Electronics | Nickel Boron | UL94 V-0 | 0.1 in | 2.54 mm | Nickel Boron | 50 µin | 1.27 µm | 50 µin | 1.27 µm | 0.11 in | 2.78 mm | Polyphenylene Sulfide (PPS) Glass Filled | 2.54 mm | 0.1 in | Through Hole | Closed Frame | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 1 A | Beryllium Nickel | Beryllium Nickel | 28 | Solder |
Aries Electronics | UL94 V-0 | 0.1 in | 2.54 mm | Tin | 200 µin | 5.08 µm | 200 µin | 5.08 µm | 0.11 in | 2.78 mm | Polyphenylene Sulfide (PPS) Glass Filled | 2.54 mm | 0.1 in | Through Hole | Closed Frame | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | 1 A | Beryllium Copper | Beryllium Copper | 28 | Solder |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 40 | $ 14.06 | |
Description
General part information
28-3570 Series
28 (2 x 14) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Tin Through Hole
Documents
Technical documentation and resources