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XMOS
Standalone parts(50)
| Part | Number of I/O | Program Memory Type | Core Size | Core Size [custom] | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) [Max] | Voltage - Supply (Vcc/Vdd) [Min] | Package / Case | Supplier Device Package | Oscillator Type | Connectivity | Mounting Type | Core Processor | Operating Temperature [Max] | Operating Temperature [Min] | Contents | Type | Function | Supplied Contents | Secondary Attributes | Utilized IC / Part | Embedded | Interface | Voltage - I/O | Clock Rate | Voltage - Core | Core Size [custom] | Core Size [custom] | Program Memory Size | Embedded | Core Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
208 | ROMless | 32 Bit | 32 Core | 4000 MIPS | 512 K | 3.6 V | 0.95 V | 324-FBGA | 324-FBGA (15x15) | External | USB | Surface Mount | XCore | 70 °C | 0 °C | |||||||||||||||||
XMOS | ||||||||||||||||||||||||||||||||
XMOS | Board(s) | |||||||||||||||||||||||||||||||
Board(s) | Audio | Audio Processing | Board(s) | I2S Interface(s) | XS1-U8 | |||||||||||||||||||||||||||
Board(s) Cable(s) Power Supply | Audio | Audio Processing | Board(s) Cable(s) Power Supply | I2S Interface(s) | XS1-L2 | |||||||||||||||||||||||||||
XMOS | 60-QFN Exposed Pad | 60-QFN (7x7) | Surface Mount | 70 °C | 0 °C | Audio Processor | I2C I2S SPI USB | 1.8 V | 16 kHz 48 kHz | 1.8 V | ||||||||||||||||||||||
84 I/O | SRAM | 1000 MIPS | 3.6 V | 0.95 V | 124-TFQFN Dual Rows Exposed Pad | 124-QFN DualRow (10x10) | External | Configurable | Surface Mount | XCore | 70 °C | 0 °C | 8-Core | 32-Bit | 128 KB | |||||||||||||||||
XMOS | 128-TQFP Exposed Pad | Surface Mount | Audio Processor | 16 kHz 48 kHz | ||||||||||||||||||||||||||||
XMOS | Audio | Voice Record/Playback | Board(s) | XVSM-2000 | Yes Other | |||||||||||||||||||||||||||
128 | FLASH | 2000 MIPS | 256 K | 3.6 V | 0.95 V | 236-LFBGA | 236-FBGA (10x10) | External | Surface Mount | XCore | 70 °C | 0 °C | 2 MB | 16-Core 32-Bit |