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Winbond Electronics
Standalone parts(327)
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| Part | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Interface | Technology | Supplier Device Package | Memory Type | Package / Case | Memory Organization | Clock Frequency | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Memory Format | Memory Size | Write Cycle Time - Word, Page | Write Cycle Time - Word, Page [custom] | Write Cycle Time - Word, Page [custom] | Memory Organization | Access Time | Memory Organization [custom] | Memory Organization [custom] | Package / Case [y] | Package / Case [x] | Package / Case [custom] | Package / Case [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 2.7 V | 3.6 V | DTR QPI Quad I/O SPI | FLASH - NOR | 8-WSON (6x5) | Non-Volatile | 8-WDFN Exposed Pad | 16M x 8 | 133 MHz | 105 °C | -40 °C | Surface Mount | FLASH | 128 Mb | 3 ms | ||||||||||
Winbond Electronics | 1.65 V | 1.95 V | QPI Quad I/O SPI | FLASH - NOR | 8-USON (4x3) | Non-Volatile | 8-UFDFN Exposed Pad | 104 MHz | 105 °C | -40 °C | Surface Mount | FLASH | 16 Mb | 3 ms | 40 µs | 2 M | 7 ns | ||||||||
Winbond Electronics | 1.7 V | 1.9 V | Parallel | SDRAM - DDR2 | 84-WBGA (8x12.5) | Volatile | 84-TFBGA | 32M x 16 | 400 MHz | 95 °C | -40 °C | Surface Mount | DRAM | 64 MB | 15 ns | 57.5 ns | |||||||||
Winbond Electronics | 2.7 V | 3.6 V | Parallel | FLASH - NAND (SLC) | 63-FBGA (11x9) | Non-Volatile | 63-VFBGA | 256M x 8 | 85 °C | -40 °C | Surface Mount | FLASH | 2 Gbit | 25 ns | 25 ns | ||||||||||
Winbond Electronics | 2.7 V | 3.6 V | QPI Quad I/O SPI | FLASH - NOR | 8-WSON (6x5) | Non-Volatile | 8-WDFN Exposed Pad | 16M x 8 | 104 MHz | 105 °C | -40 °C | Surface Mount | FLASH | 128 Mb | 3 ms | 50 µs | |||||||||
Winbond Electronics | 2.3 V | 3.6 V | SPI - Quad I/O | FLASH - NOR | 8-SOIC | Non-Volatile | 8-SOIC | 104 MHz | 85 °C | -40 °C | Surface Mount | FLASH | 1024 KB | 3 ms | 1 M | 8 bits | 3.9 mm | 0.154 in | |||||||
Winbond Electronics | 2.7 V | 3.6 V | SPI | FLASH | 8-SOIC | Non-Volatile | 8-SOIC | 75 MHz | 85 °C | -40 °C | Surface Mount | FLASH | 512 kb | 3 ms | 512 K | 5.3 mm | 0.209 " | ||||||||
Winbond Electronics | 3 V | 3.6 V | Parallel | SDRAM | 90-TFBGA (8x13) | Volatile | 90-TFBGA | 2M x 32 | 166 MHz | 85 °C | -40 °C | Surface Mount | DRAM | 64 Gbit | 5 ns | ||||||||||
Winbond Electronics | 1.283 V | 1.45 V | Parallel | SDRAM - DDR3L | 7.5x13 96-VFBGA | Volatile | 96-VFBGA | 800 MHz | 95 °C | -40 °C | Surface Mount | DRAM | 2 Gbit | 15 ns | 128 M | 20 ns | |||||||||
Winbond Electronics | 2.3 V | 2.7 V | Parallel | 66-TSOP II | Volatile | 66-TSSOP | 250 MHz | 70 °C | 0 °C | Surface Mount | DRAM | 256 Gbit | 15 ns | 16 M | 55 ns | 0.4 in | 0.4 in |