44-6554 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Contact Material - Mating	Mounting Type	Pitch - Post	Pitch - Post	Housing Material	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Features	Contact Material - Post	Material Flammability Rating	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Current Rating (Amps)	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 44-6554-16	Beryllium Copper	Through Hole	2.54 mm	0.1 in	Polyphenylene Sulfide (PPS) Glass Filled	Nickel Boron	0.1 in	2.54 mm	Closed Frame	Beryllium Copper	UL94 V-0	15.24 mm	DIP ZIF (ZIP)	0.6 "	1.27 µm	50 µin	44 Positions or Pins	1 A	0.11 in	2.78 mm	1.27 µm	50 µin	Solder	Nickel Boron
Aries Electronics 44-6554-11	Beryllium Copper	Through Hole	2.54 mm	0.1 in	Polyphenylene Sulfide (PPS) Glass Filled	Gold	0.1 in	2.54 mm	Closed Frame	Beryllium Copper	UL94 V-0	15.24 mm	DIP ZIF (ZIP)	0.6 "			44 Positions or Pins	1 A	0.11 in	2.78 mm			Solder	Gold
Aries Electronics 44-6554-10	Beryllium Copper	Through Hole	2.54 mm	0.1 in	Polyphenylene Sulfide (PPS) Glass Filled	Tin	0.1 in	2.54 mm	Closed Frame	Beryllium Copper	UL94 V-0	15.24 mm	DIP ZIF (ZIP)	0.6 "	5.08 µm	200 µin	44 Positions or Pins	1 A	0.11 in	2.78 mm	5.08 µm	200 µin	Solder
Aries Electronics 44-6554-18	Beryllium Nickel	Through Hole	2.54 mm	0.1 in	Polyetheretherketone (PEEK) Glass Filled	Nickel Boron	0.1 in	2.54 mm	Closed Frame	Beryllium Nickel	UL94 V-0	15.24 mm	DIP ZIF (ZIP)	0.6 "	1.27 µm	50 µin	44 Positions or Pins	1 A	0.11 in	2.78 mm	1.27 µm	50 µin	Solder	Nickel Boron	-55 °C	250 °C