HEATSINK ASSY INTEL LGA1366
| Part | Attachment Method | Type | Thermal Resistance @ Natural | Material | Width [y] | Width [y] | Length | Length | Fin Height | Fin Height | Package Cooled | Shape |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
Delta Electronics | Bolt On | Board Level | 0.27 °C/W | Aluminum | 3.543 " | 90 mm | 90 mm | 3.543 in | 1.004 in | 25.5 mm | LGA | Square |