50-9508 Series

Catalog

CONN IC DIP SOCKET 50POS GOLD

Part	Type	Type	Type	Contact Finish - Mating	Termination	Pitch - Post	Pitch - Post	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]	Pitch - Mating	Pitch - Mating	Mounting Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Material - Post [custom]	Contact Finish - Post	Features	Termination Post Length [x]	Termination Post Length [x]	Contact Material - Mating
Aries Electronics 50-9508-21	22.86 mm	DIP	0.9 in	Gold	Wire Wrap	2.54 mm	0.1 in	UL94 V-0	10 çin	0.25 çm	30 Áin	0.76 Ám	Glass Filled Nylon 4/6 Polyamide (PA46)	3 A	-55 °C	125 °C	0.1 in	2.54 mm	Through Hole	25	2	50	Brass	Gold	Open Frame	0.36 in	9.14 mm	Beryllium Copper
Aries Electronics 50-9508-20	22.86 mm	DIP	0.9 in	Gold	Wire Wrap	2.54 mm	0.1 in	UL94 V-0	200 µin	5.08 µm	30 Áin	0.76 Ám	Glass Filled Nylon 4/6 Polyamide (PA46)	3 A	-55 °C	105 ░C	0.1 in	2.54 mm	Through Hole	25	2	50	Brass	Tin	Open Frame	0.36 in	9.14 mm	Beryllium Copper