IC DRAM 128MBIT PAR 54TFBGA
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Memory Type | Voltage - Supply [Max] | Voltage - Supply [Min] | Memory Organization | Access Time | Clock Frequency | Package / Case | Memory Interface | Memory Size | Memory Format | Supplier Device Package | Technology | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 70 °C | 0 °C | Volatile | 3.6 V | 3 V | 8M x 16 | 5 ns | 166 MHz | 54-TFBGA | Parallel | 128 Mb | DRAM | 54-TFBGA (8x8) | SDRAM | Surface Mount |
Winbond Electronics | Volatile | 3.6 V | 3 V | 8M x 16 | 5 ns | 166 MHz | 54-TFBGA | LVTTL | 128 Mb | DRAM | 54-TFBGA (8x8) | SDRAM | Surface Mount | ||
Winbond Electronics | 70 °C | 0 °C | Volatile | 3.6 V | 3 V | 8M x 16 | 5 ns | 166 MHz | LVTTL | 128 Mb | DRAM | 54-TSOP II | SDRAM | Surface Mount | |
Winbond Electronics | 70 °C | 0 °C | Volatile | 3.6 V | 3 V | 8M x 16 | 4.5 ns | 200 MHz | Parallel | 128 Mb | DRAM | 54-TSOP II | SDRAM | Surface Mount | |
Winbond Electronics | 85 °C | -40 °C | Volatile | 3.6 V | 3 V | 8M x 16 | 5 ns | 166 MHz | LVTTL | 128 Mb | DRAM | 54-TSOP II | SDRAM | Surface Mount | |
Winbond Electronics | 85 °C | -40 °C | Volatile | 3.6 V | 3 V | 8M x 16 | 5 ns | 166 MHz | Parallel | 128 Mb | DRAM | 54-TSOP II | SDRAM | Surface Mount | |
Winbond Electronics | 85 °C | -40 °C | Volatile | 3.6 V | 3 V | 8M x 16 | 5 ns | 166 MHz | 54-TFBGA | Parallel | 128 Mb | DRAM | 54-TFBGA (8x8) | SDRAM | Surface Mount |
Winbond Electronics | 70 °C | 0 °C | Volatile | 3.6 V | 3 V | 8M x 16 | 5 ns | 166 MHz | Parallel | 128 Mb | DRAM | 54-TSOP II | SDRAM | Surface Mount | |
Winbond Electronics | 70 °C | 0 °C | Volatile | 3.6 V | 3 V | 8M x 16 | 4.5 ns | 200 MHz | LVTTL | 128 Mb | DRAM | 54-TSOP II | SDRAM | Surface Mount | |
Winbond Electronics | 70 °C | 0 °C | Volatile | 3.6 V | 3 V | 8M x 16 | 4.5 ns | 200 MHz | LVTTL | 128 Mb | DRAM | 54-TSOP II | SDRAM | Surface Mount |