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SOLDER PASTE NO CLEAN 500GM
| Part | Form | Form | Melting Point [Min] | Melting Point [Min] | Melting Point [Max] | Melting Point [Max] | Composition | Shelf Life Start | Shelf Life | Mesh Type [custom] | Flux Type | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Min] | Type | Form | Mesh Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Kester Solder | Jar | 17.64 oz 500 g | 217 °C | 423 °F | 218 °C | 424 °F | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Date of Manufacture | 12 Months | 4 | No-Clean | 0 °C | 50 °F | 10 °C | 0 °C | Solder Paste | ||
Kester Solder | 700 g | 217 °C | 423 °F | 218 °C | 424 °F | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Date of Manufacture | 12 Months | 4 | No-Clean | 0 °C | 50 °F | 10 °C | 0 °C | Solder Paste | 24.69 oz | ||
Kester Solder | Jar | 17.64 oz 500 g | 217 °C | 423 °F | 218 °C | 424 °F | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Date of Manufacture | 12 Months | No-Clean | 0 °C | 50 °F | 10 °C | 0 °C | Solder Paste | 3 | ||
Kester Solder | Cartridge | 600 g | 217 °C | 423 °F | 218 °C | 424 °F | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Date of Manufacture | 12 Months | 4 | No-Clean | 0 °C | 50 °F | 10 °C | 0 °C | Solder Paste | 21.16 oz | |
Kester Solder | Cartridge | 600 g | 217 °C | 423 °F | 218 °C | 424 °F | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Date of Manufacture | 12 Months | No-Clean | 0 °C | 50 °F | 10 °C | 0 °C | Solder Paste | 21.16 oz | 3 |