Beta
⌘K
P4,775-LAND LGA
| Part | Fin Height [z] | Fin Height [z] | Type | Attachment Method | Material | Package Cooled | Shape | Thermal Resistance @ Forced Air Flow |
|---|---|---|---|---|---|---|---|---|
Sanyo Denki America Inc. | 62.6 mm | 2.465 in | Board Level | Clip | Aluminum Plastic | Pentium® III & Pentium® 4 | Round | 0.27 °C/W |