SOLDER PASTE NO CLEAN 500GM
| Part | Form | Form | Flux Type | Composition | Composition | Shelf Life | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Min] | Shelf Life Start | Type | Melting Point [Max] [custom] | Melting Point [Max] [custom] | Melting Point [Min] [custom] | Melting Point [Min] [custom] | Mesh Type | Shipping Info |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Kester Solder | Jar | 17.64 oz 500 g | No-Clean | Sn96.3Ag3.7 | 96.3/3.7 | 4 Months | 0 °C | 50 °F | 10 °C | 0 °C | Date of Manufacture | Solder Paste | 444 °F | 223 °C | 221 °C | 430 °F | 3 | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. |