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IC MCU 32BIT 3MB FLASH 176LQFP
| Part | Program Memory Size | Core Processor | Operating Temperature [Min] | Operating Temperature [Max] | Supplier Device Package | Oscillator Type | Package / Case | RAM Size | EEPROM Size | Connectivity | Program Memory Type | Data Converters | Core Size | Mounting Type | Voltage - Supply (Vcc/Vdd) [Max] | Voltage - Supply (Vcc/Vdd) [Min] | Peripherals | Speed | Number of I/O | Core Size [custom] | Grade | Qualification | Speed | Speed |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Freescale Semiconductor - NXP | 3 MB | e200z4 | -40 °C | 125 °C | 176-LQFP (24x24) | Internal | 176-LQFP Exposed Pad | 384 K | 64 K | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | 16x12b 36x10b | 32-Bit Single-Core | Surface Mount | 5.5 V | 3.15 V | DMA LVD POR WDT | 160 MHz | 129 I/O | |||||
Freescale Semiconductor - NXP | 3 MB | e200z4 | -40 °C | 105 °C | 176-LQFP (24x24) | Internal | 176-LQFP Exposed Pad | 384 K | 64 K | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | 16x12b 36x10b | 32-Bit Single-Core | Surface Mount | 5.5 V | 3.15 V | DMA LVD POR WDT | 160 MHz | 129 I/O | |||||
Freescale Semiconductor - NXP | 3 MB | e200z4 | -40 °C | 125 °C | 100-MAPBGA (11x11) | Internal | 100-LFBGA | 384 K | 64 K | CANbus Ethernet FlexRay I2C LINbus SPI | FLASH | 16x12b 36x10b | 32-Bit Single-Core | Surface Mount | 5.5 V | 3.15 V | DMA I2S POR WDT | 120 MHz | ||||||
Freescale Semiconductor - NXP | 3 MB | e200z4 | -40 °C | 125 °C | 176-LQFP (24x24) | Internal | 176-LQFP Exposed Pad | 384 K | 64 K | CANbus Ethernet FlexRay I2C LINbus SPI | FLASH | 16x12b 36x10b | 32-Bit Single-Core | Surface Mount | 5.5 V | 3.15 V | DMA I2S POR WDT | 120 MHz | 129 I/O | |||||
Freescale Semiconductor - NXP | 3 MB | e200z2 e200z4 | -40 °C | 125 °C | 100-MAPBGA (11x11) | Internal | 100-LFBGA | 512 K | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | Surface Mount | 5.5 V | 3 V | DMA LVD POR WDT | 80 MHz 160 MHz | 32-Bit Dual-Core | ||||||||
Freescale Semiconductor - NXP | 3 MB | e200z2 e200z4 | -40 °C | 125 °C | 256-MAPPBGA (17x17) | Internal | 256-LBGA | 512 K | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | Surface Mount | 5.5 V | 3 V | DMA LVD POR WDT | 80 MHz 160 MHz | 178 | 32-Bit Dual-Core | |||||||
Freescale Semiconductor - NXP | 3 MB | e200z2 e200z4 | -40 °C | 125 °C | 176-LQFP (24x24) | Internal | 176-LQFP Exposed Pad | 384 K | 128 K | CANbus Ethernet FlexRay I2C LINbus SAI SPI | FLASH | 31x12b SAR A/D 68x10b | Surface Mount | 5.5 V | 3.15 V | DMA I2S LVD/HVD POR WDT | 80 MHz 160 MHz | 129 I/O | 32-Bit Dual-Core | Automotive | AEC-Q100 | |||
Freescale Semiconductor - NXP | 3 MB | e200z2 e200z4 | -40 °C | 85 °C | 176-LQFP (24x24) | Internal | 176-LQFP Exposed Pad | 512 K | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | Surface Mount | 5.5 V | 3 V | DMA LVD POR WDT | 80 MHz 160 MHz | 129 I/O | 32-Bit Dual-Core | |||||||
Freescale Semiconductor - NXP | 3 MB | e200z2 e200z4 | -40 °C | 125 °C | 176-LQFP (24x24) | Internal | 176-LQFP Exposed Pad | 768 K | 128 K | CANbus Ethernet FlexRay I2C LINbus SAI SPI USB USB OTG | FLASH | 64x12b SAR 80x10b SAR | 32-Bit Tri-Core | Surface Mount | 5.5 V | 3.15 V | DMA I2S LVD POR WDT | 80 MHz | 129 I/O | Automotive | AEC-Q100 | 160 MHz | 160 MHz | |
Freescale Semiconductor - NXP | 3 MB | e200z2 e200z4 | -40 °C | 85 °C | 100-MAPBGA (11x11) | Internal | 100-LFBGA | 384 K | 128 K | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | 16x12b 36x10b | Surface Mount | 5.5 V | 3.15 V | DMA LVD POR WDT | 80 MHz | 65 | 32-Bit Dual-Core | 200 MHz |