CONN EDGE DUAL FML 130POS 0.100
| Part | Pitch [x] | Pitch [x] | Contact Finish Thickness | Contact Finish Thickness | Number of Positions/Bay/Row [custom] | Read Out | Material - Insulation | Mounting Type | Number of Rows | Termination Rows | Card Thickness [Min] | Card Thickness [Min] | Card Thickness [Max] | Card Thickness [Max] | Contact Type | Color | Number of Positions | Flange Feature | Contact Finish | Features | Contact Material | Termination | Operating Temperature [Max] | Operating Temperature [Min] | Gender | Card Type | Flange Feature [diameter] | Flange Feature [diameter] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
EDAC Inc. | 2.54 mm | 0.1 in | 10 Áin | 0.25 Ám | 65 | Dual | Polyphenylene Sulfide (PPS) | Board Edge Straddle Mount | 2 | 2 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Cantilever | Black | 130 | 4-40 Flush Mount Threaded Insert Top Opening | Gold | Card Extender | Copper Alloy | Solder | 125 °C | -40 °C | Female | Non Specified - Dual Edge | ||
EDAC Inc. | 2.54 mm | 0.1 in | 10 Áin | 0.25 Ám | 65 | Dual | Polyphenylene Sulfide (PPS) | Board Edge Straddle Mount | 2 | 2 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Cantilever | Black | 130 | Flush Mount Side Opening Unthreaded | Gold | Card Extender | Copper Alloy | Solder | 125 °C | -40 °C | Female | Non Specified - Dual Edge | 3.25 mm | 0.128 " |
EDAC Inc. | 2.54 mm | 0.1 in | 10 Áin | 0.25 Ám | 65 | Dual | Polyphenylene Sulfide (PPS) | Board Edge Straddle Mount | 2 | 2 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Cantilever | Black | 130 | Top Mount Opening Unthreaded | Gold | Card Extender | Copper Alloy | Solder | 125 °C | -40 °C | Female | Non Specified - Dual Edge | 3.96 mm | 0.156 in |
EDAC Inc. | 2.54 mm | 0.1 in | 10 Áin | 0.25 Ám | 65 | Dual | Polyphenylene Sulfide (PPS) | Through Hole | 2 | 2 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Cantilever | Black | 130 | 4-40 Threaded Insert Top Mount Opening | Gold | Copper Alloy | Solder | 125 °C | -40 °C | Female | Non Specified - Dual Edge | |||
EDAC Inc. | 2.54 mm | 0.1 in | 10 Áin | 0.25 Ám | 65 | Dual | Polyphenylene Sulfide (PPS) | Through Hole | 2 | 2 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Cantilever | Black | 130 | Gold | Copper Alloy | Solder | 125 °C | -40 °C | Female | Non Specified - Dual Edge | ||||
EDAC Inc. | 2.54 mm | 0.1 in | 10 Áin | 0.25 Ám | 65 | Dual | Polyphenylene Sulfide (PPS) | Board Edge Straddle Mount | 2 | 2 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Cantilever | Black | 130 | Floating Bobbin Top Mount Opening | Gold | Card Extender | Copper Alloy | Solder | 125 °C | -40 °C | Female | Non Specified - Dual Edge | 2.95 mm | 0.116 in |
EDAC Inc. | 2.54 mm | 0.1 in | 10 Áin | 0.25 Ám | 65 | Dual | Polyphenylene Sulfide (PPS) | Through Hole | 2 | 2 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Cantilever | Black | 130 | Floating Bobbin Flush Mount | Gold | Copper Alloy | Wire Wrap | 125 °C | -40 °C | Female | Non Specified - Dual Edge | 2.95 mm | 0.116 in | |
EDAC Inc. | 2.54 mm | 0.1 in | 10 Áin | 0.25 Ám | 65 | Dual | Polyphenylene Sulfide (PPS) | Through Hole | 2 | 2 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Cantilever | Black | 130 | Floating Bobbin Top Mount Opening | Gold | Copper Alloy | Solder | 125 °C | -40 °C | Female | Non Specified - Dual Edge | 2.95 mm | 0.116 in | |
EDAC Inc. | 2.54 mm | 0.1 in | 10 Áin | 0.25 Ám | 65 | Dual | Polyphenylene Sulfide (PPS) | Through Hole | 2 | 2 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Cantilever | Black | 130 | 4-40 Threaded Insert Top Mount Opening | Gold | Copper Alloy | Solder | 125 °C | -40 °C | Female | Non Specified - Dual Edge | |||
EDAC Inc. | 2.54 mm | 0.1 in | 10 Áin | 0.25 Ám | 65 | Dual | Polyphenylene Sulfide (PPS) | Through Hole | 2 | 2 | 1.37 mm | 0.054 " | 1.78 mm | 0.07 in | Cantilever | Black | 130 | M3 Threaded Insert Top Mount Opening | Gold | Copper Alloy | Wire Wrap | 125 °C | -40 °C | Female | Non Specified - Dual Edge |