16-C280 Series

Catalog

CONN IC DIP SOCKET 16POS GOLD

Part	Pitch - Post	Pitch - Post	Termination	Contact Material - Post [custom]	Contact Finish - Mating	Contact Material - Mating	Number of Positions or Pins (Grid)	Mounting Type	Features	Pitch - Mating	Pitch - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Type	Type	Type	Material Flammability Rating	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination Post Length	Termination Post Length
Aries Electronics 16-C280-00	2.54 mm	0.1 in	Solder	Brass	Gold	Beryllium Copper	16	Surface Mount	Closed Frame	0.1 in	2.54 mm	105 ░C	-55 °C	0.3 "	7.62 mm	DIP	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	3 A	Tin	10 çin	0.25 çm	0.04 in	1.02 mm
Aries Electronics 16-C280-20	2.54 mm	0.1 in	Wire Wrap	Brass	Gold	Beryllium Copper	16	Through Hole	Closed Frame	0.1 in	2.54 mm	105 ░C	-55 °C	0.3 "	7.62 mm	DIP	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	3 A	Tin	10 çin	0.25 çm	0.04 in	1.02 mm
Aries Electronics 16-C280-11	2.54 mm	0.1 in	Solder	Brass	Gold	Beryllium Copper	16	Through Hole	Closed Frame	0.1 in	2.54 mm	125 °C	-55 °C	0.3 "	7.62 mm	DIP	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	3 A	Gold	10 çin	0.25 çm	0.125 in	3.18 mm
Aries Electronics 16-C280-31	2.54 mm	0.1 in	Wire Wrap	Brass	Gold	Beryllium Copper	16	Through Hole	Closed Frame	0.1 in	2.54 mm	125 °C	-55 °C	0.3 "	7.62 mm	DIP	UL94 V-0	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	3 A	Gold	10 çin	0.25 çm	0.04 in	1.02 mm