Beta
⌘K
P4,775-LAND LGA
| Part | Shape | Type | Attachment Method | Fin Height [z] | Fin Height [z] | Package Cooled | Thermal Resistance @ Forced Air Flow | Material |
|---|---|---|---|---|---|---|---|---|
Sanyo Denki America Inc. | Round | Board Level | Clip | 62.6 mm | 2.465 in | Pentium® III & Pentium® 4 | 0.28 °C/W | Aluminum Plastic |