04-0518 Series

Catalog

CONN SOCKET SIP 4POS GOLD

Part	Type	Housing Material	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Mounting Type	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Features	Contact Material - Mating	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Contact Finish - Mating	Termination Post Length	Termination Post Length	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 04-0518-11H	SIP	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	4	1 x 4	Through Hole	UL94 V-0	0.1 in	2.54 mm	Brass	10 çin	0.25 çm	Gold	Open Frame	Beryllium Copper	Solder	10 çin	0.25 çm	3 A	Gold	3.18 mm	0.125 in
Aries Electronics 04-0518-00	SIP	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	4	1 x 4	Surface Mount	UL94 V-0	0.1 in	2.54 mm	Brass	10 çin	0.25 çm	Tin	Open Frame	Beryllium Copper	Solder	200 µin	5.08 µm	3 A	Gold			0.046 in	1.17 mm
Aries Electronics 04-0518-10H	SIP	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	4	1 x 4	Through Hole	UL94 V-0	0.1 in	2.54 mm	Brass	10 çin	0.25 çm	Tin	Open Frame	Beryllium Copper	Solder	200 µin	5.08 µm	3 A	Gold	3.18 mm	0.125 in
Aries Electronics 04-0518-11	SIP	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	4	1 x 4	Through Hole	UL94 V-0	0.1 in	2.54 mm	Brass	10 çin	0.25 çm	Gold	Open Frame	Beryllium Copper	Solder	10 çin	0.25 çm	3 A	Gold	3.18 mm	0.125 in