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CONN IC DIP SOCKET 40POS GOLD
| Part | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Features | Contact Finish - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post [custom] | Termination Post Length | Termination Post Length | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Material Flammability Rating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Pitch - Post | Pitch - Post | Type | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 40 | 20 | 2 | Closed Frame Elevated | Gold | 105 ░C | -55 °C | Through Hole | Glass Filled Nylon 4/6 Polyamide (PA46) | 30 Áin | 0.76 Ám | Brass | 3.56 mm | 0.14 in | 3 A | 0.1 in | 2.54 mm | Beryllium Copper | UL94 V-0 | Gold | 10 çin | 0.25 çm | Solder | 2.54 mm | 0.1 in | DIP | 0.6 in | 15.24 mm |