Beta
⌘K
IC & COMPONENT SOCKET, 64 CONTACTS, DIP SOCKET, 2.54 MM, 264 SERIES, 22.86 MM, BERYLLIUM COPPER
| Part | Contact Finish - Mating | Pitch - Post | Pitch - Post | Contact Material - Mating | Termination Post Length | Termination Post Length | Number of Positions or Pins (Grid) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Type | Type | Type | Termination | Mounting Type | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Housing Material | Operating Temperature [Min] | Operating Temperature [Max] | Features | Material Flammability Rating | Contact Material - Post | Contact Resistance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
3M (TC) | Gold | 2.54 mm | 0.1 in | Beryllium Copper | 0.11 in | 2.78 mm | 64 | 30 µin | 0.76 µm | 0.1 in | 2.54 mm | Gold | 22.86 mm | DIP ZIF (ZIP) | 0.9 in | Press-Fit | Connector | 1 A | 30 Áin | 0.76 Ám | Polysulfone (PSU) Glass Filled | -55 °C | 125 °C | Closed Frame | UL94 V-0 | Beryllium Copper | |
3M (TC) | |||||||||||||||||||||||||||
3M (TC) | Gold | 1.78 mm | 0.07 in | Beryllium Copper | 0.11 in | 2.78 mm | 64 | 30 µin | 0.76 µm | 0.07 in | 1.78 mm | Gold | 22.86 mm | DIP ZIF (ZIP) | 0.9 in | Press-Fit | Connector | 1 A | 30 Áin | 0.76 Ám | Polysulfone (PSU) Glass Filled | -55 °C | 125 °C | Closed Frame | UL94 V-0 | Beryllium Copper | 15 mOhm |