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CONN IC DIP SOCKET 36POS GOLD
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Housing Material | Number of Positions or Pins (Grid) | Material Flammability Rating | Pitch - Post | Pitch - Post | Contact Material - Post | Current Rating (Amps) | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Finish - Mating | Type | Type | Type | Mounting Type | Termination Post Length | Termination Post Length | Termination | Pitch - Mating | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 105 ░C | -55 °C | Glass Filled Nylon 4/6 Polyamide (PA46) | 36 | UL94 V-0 | 2.54 mm | 0.1 in | Phosphor Bronze | 3 A | Beryllium Copper | Tin | 10 çin | 0.25 çm | 200 µin | 5.08 µm | Closed Frame | Gold | 0.3 " | 7.62 mm | DIP | Through Hole | 0.5 in | 12.7 mm | Wire Wrap | 0.1 in | 2.54 mm |
Aries Electronics | 125 °C | -55 °C | Glass Filled Nylon 4/6 Polyamide (PA46) | 36 | UL94 V-0 | 2.54 mm | 0.1 in | Phosphor Bronze | 3 A | Beryllium Copper | Gold | 10 çin | 0.25 çm | 10 çin | 0.25 çm | Closed Frame | Gold | 0.3 " | 7.62 mm | DIP | Through Hole | 0.5 in | 12.7 mm | Wire Wrap | 0.1 in | 2.54 mm |